Datasheet CPD69 Equivalent ( PDF )

PROCESS General Purpose Rectifier 1 Amp Glass Passivated Rectifier Chip CPD69 PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 42.5 x 42.5 MILS 12.5 MILS 32 x 32 MILS Ni/Au - 5,000Å/2,000Å Ni/Au - 5,000Å/2,

N.º	Número de pieza	Descripción	Fabricantes	PDF
1	CPD69	1 Amp Glass Passivated Rectifier Chip PROCESS General Purpose Rectifier 1 Amp Glass Passivated Rectifier Chip CPD69 PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 42.5 x 42.5 MILS 12.5 MILS 32 x 32 MILS Ni/Au - 5,000Å/2,000Å Ni/Au - 5,000Å/2,	centralsemi