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Bidirectional ESD / Transient Suppressor CPD Series (RoHS Device) Features (16kV) IEC 61000-4-2 rating Surface mount package High component density -VBD 0V +VBD Applications ESD suppression Transient suppression Automotive CAN Bus Circuit Schematic Package W d 1E, U W L P L
PROCESS Ultra Fast Rectifier CPD17 3 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 88 x 88 MILS 14 MILS 69 x 69 MILS Ni/Au - 5,000Å/2,000Å Ni/Au -
PROCESS Ultra Fast Rectifier CPD16 1 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 51 x 51 MILS 14 MILS 34 x 34 MILS Ni/Au - 5,000Å/2,000Å Ni/Au -
PROCESS Ultra Fast Rectifier CPD18 8 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 100 x 100 MILS 14 MILS 78 x 78 MILS Ni/Au - 5,000Å/2,000Å Ni/Au
PROCESS Ultra Fast Rectifier CPD15 Central TM 500mA Glass Passivated Rectifier Chip Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 25 x 25 MILS 9.5 MILS 14.5 x 14.5 MILS Au - 5,000Å
PROCESS CPD109R Schottky Diode Low VF Schottky Diode Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 8.3 x 8.3 MILS 3.9 MILS 5.4 x 5.4 MILS Al - 20,000Å Au - 12,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 251,364 PRINCIPAL DEVICE TYP
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PartNumber.co.kr | 2020 | 연락처 |