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Datasheet CHFP6KE16 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | |
| 4 | CHFP6KE16 | Patented Flip-Chip Series 8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503
FLIP-CHIP TVS DIODES
CHFP6KE5.0
thru
CHFP6KE170CA
FEATURES
• • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No vo |
 Microsemi Corporation |
 |
| 3 | CHFP6KE160 | Patented Flip-Chip Series 8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503
FLIP-CHIP TVS DIODES
CHFP6KE5.0
thru
CHFP6KE170CA
FEATURES
• • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No vo |
Microsemi Corporation |
|
| 2 | CHFP6KE160A | Patented Flip-Chip Series 8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503
FLIP-CHIP TVS DIODES
CHFP6KE5.0
thru
CHFP6KE170CA
FEATURES
• • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No vo |
Microsemi Corporation |
|
| 1 | CHFP6KE16A | Patented Flip-Chip Series 8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503
FLIP-CHIP TVS DIODES
CHFP6KE5.0
thru
CHFP6KE170CA
FEATURES
• • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No vo |
Microsemi Corporation |
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