Datasheet ACT-E128K32N-200P3C Equivalent ( PDF )

N.º	Número de pieza	Descripción	Fabricantes	PDF
1	ACT-E128K32N-200P3C	ACT-E128K32 High Speed 4 Megabit EEPROM Multichip Module ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module Features Package ■ Organized as 128K x 32 ● User CIRCUIT TECHNOLOGY www.aeroflex.com ■ 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Configurable to 256K x 16 or 512K x 8 ■ CMOS and TTL Compatible	Aeroflex Circuit Technology

ACT-E128K32N-200 Datasheet ( Hoja de datos ) - resultados coincidentes

Número de pieza	Descripción	Fabricantes	PDF
ACT-E128K32N-200P7T	ACT-E128K32 High Speed 4 Megabit EEPROM Multichip Module ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module Features Package ■ Organized as 128K x 32 ● User CIRCUIT TECHNOLOGY www.aeroflex.com ■ 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Configurable to 256K x 16 or 512K x 8 ■ CMOS	Aeroflex Circuit Technology
ACT-E128K32N-200P7Q	ACT-E128K32 High Speed 4 Megabit EEPROM Multichip Module ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module Features Package ■ Organized as 128K x 32 ● User CIRCUIT TECHNOLOGY www.aeroflex.com ■ 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Configurable to 256K x 16 or 512K x 8 ■ CMOS	Aeroflex Circuit Technology
ACT-E128K32N-200P3I	ACT-E128K32 High Speed 4 Megabit EEPROM Multichip Module ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module Features Package ■ Organized as 128K x 32 ● User CIRCUIT TECHNOLOGY www.aeroflex.com ■ 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Configurable to 256K x 16 or 512K x 8 ■ CMOS	Aeroflex Circuit Technology

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Número de pieza	Descripción	Fabricantes	PDF
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