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ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module Features Package ■ Organized as 128K x 32 ● User CIRCUIT TECHNOLOGY www.aeroflex.com ■ 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Configurable to 256K x 16 or 512K x 8 ■ CMOS and TTL Compatible
ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module Features Package ■ Organized as 128K x 32 ● User CIRCUIT TECHNOLOGY www.aeroflex.com ■ 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Configurable to 256K x 16 or 512K x 8 ■ CMOS and TTL Compatible
ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module Features Package ■ Organized as 128K x 32 ● User CIRCUIT TECHNOLOGY www.aeroflex.com ■ 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Configurable to 256K x 16 or 512K x 8 ■ CMOS and TTL Compatible
ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module Features Package ■ Organized as 128K x 32 ● User CIRCUIT TECHNOLOGY www.aeroflex.com ■ 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Configurable to 256K x 16 or 512K x 8 ■ CMOS and TTL Compatible
ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module Features Package ■ Organized as 128K x 32 ● User CIRCUIT TECHNOLOGY www.aeroflex.com ■ 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Configurable to 256K x 16 or 512K x 8 ■ CMOS and TTL Compatible
ACT–E128K32 High Speed 4 Megabit EEPROM Multichip Module Features Package ■ Organized as 128K x 32 ● User CIRCUIT TECHNOLOGY www.aeroflex.com ■ 4 Low Power 128K x 8 EEPROM Die in One MCM ■ Packaging – Hermetic Ceramic Configurable to 256K x 16 or 512K x 8 ■ CMOS and TTL Compatible
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