파트넘버.co.kr 2214-200G 데이터시트 검색

2214-200G 전자부품 데이터시트



2214-200G 전자부품 회로 및
기능 검색 결과



2214-200G  

ETC
ETC

2214-200G

20-TAPDIPDELAYLINETD/TR=10(SERIES2214)

2214 20-TAP DIP DELAY LINE TD/TR = 10 (SERIES 2214) FEATURES • • • • • 20 taps of equal delay increment High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C N/C IN T1 T2 T3 T4 T5 T6 T7 T8 T9 GND 1 2 3 4 5 6 7 8 9 1




관련 부품 2214-20 상세설명

2214-200D  

  
20-TAPDIPDELAYLINETD/TR=10(SERIES2214)

2214 20-TAP DIP DELAY LINE TD/TR = 10 (SERIES 2214) FEATURES • • • • • 20 taps of equal delay increment High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C N/C IN T1 T2 T3 T4 T5 T6 T7 T8 T9 GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14



ETC
ETC

PDF



2214-200C  

  
20-TAPDIPDELAYLINETD/TR=10(SERIES2214)

2214 20-TAP DIP DELAY LINE TD/TR = 10 (SERIES 2214) FEATURES • • • • • 20 taps of equal delay increment High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C N/C IN T1 T2 T3 T4 T5 T6 T7 T8 T9 GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14



ETC
ETC

PDF



2214-200B  

  
20-TAPDIPDELAYLINETD/TR=10(SERIES2214)

2214 20-TAP DIP DELAY LINE TD/TR = 10 (SERIES 2214) FEATURES • • • • • 20 taps of equal delay increment High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C N/C IN T1 T2 T3 T4 T5 T6 T7 T8 T9 GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14



ETC
ETC

PDF



2214-200A  

  
20-TAPDIPDELAYLINETD/TR=10(SERIES2214)

2214 20-TAP DIP DELAY LINE TD/TR = 10 (SERIES 2214) FEATURES • • • • • 20 taps of equal delay increment High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C N/C IN T1 T2 T3 T4 T5 T6 T7 T8 T9 GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14



ETC
ETC

PDF



2214-2000G  

  
20-TAPDIPDELAYLINETD/TR=10(SERIES2214)

2214 20-TAP DIP DELAY LINE TD/TR = 10 (SERIES 2214) FEATURES • • • • • 20 taps of equal delay increment High bandwidth (TD/TR =10) Low profile Epoxy encapsulated Meets or exceeds MIL-D-23859C N/C IN T1 T2 T3 T4 T5 T6 T7 T8 T9 GND 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14



ETC
ETC

PDF




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