219
CTS
SMT DIPSeries 219 SMT DIP
®
Surface Mount DIP Switch — Auto Placeable
Features
Optimized Mechanical Features • Removable tape seal to withstand IR vapor phase or wave soldering temperatures,and board washing • Positive detent separate from
219-2LPSTR
CTS
SMT DIPSeries 219 SMT DIP
®
Surface Mount DIP Switch — Auto Placeable
Features
Optimized Mechanical Features • Removable tape seal to withstand IR vapor phase or wave soldering temperatures,and board washing • Positive detent separate from
219-4MST
CTS
(219-xxMST) DIP Switchç Prev Page
DIP Switches
CTS
Next Page è
Fig. 1 - Top Actuated Slide
Electrical Specifications:
6
8 7 5 4
Initial Contact Resistance: 25mΩ (209, 219 Series); 50mΩ (193, 194, 204, and 206 Series); 100mΩ (195, 208, and 218 Series). Maximum Contact Resis
219-xxMST
CTS
(219-xxMST) DIP Switchç Prev Page
DIP Switches
CTS
Next Page è
Fig. 1 - Top Actuated Slide
Electrical Specifications:
6
8 7 5 4
Initial Contact Resistance: 25mΩ (209, 219 Series); 50mΩ (193, 194, 204, and 206 Series); 100mΩ (195, 208, and 218 Series). Maximum Contact Resis
219-xxxx
CTS
SMT DIPSeries 219 SMT DIP
®
Surface Mount DIP Switch — Auto Placeable
Features
Optimized Mechanical Features • Removable tape seal to withstand IR vapor phase or wave soldering temperatures,and board washing • Positive detent separate from
2192VE
LatticeSemiconductor
3.3VIn-SystemProgrammableSuperFASTHighDensityPLDispLSI 2192VE
3.3V In-System Programmable SuperFAST™ High Density PLD Features
• SuperFAST HIGH DENSITY IN-SYSTEM PROGRAMMABLE LOGIC — 8000 PLD Gates — 96 I/O Pins, Nine or Twelve Dedicated Inputs — 192 Registers — High Speed Global Interconnect �