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International Rectifier |
PD - 90333F
REPETITIVE AVALANCHE AND dv/dt RATED
HEXFETTRANSISTORS
IRF130
JANTX2N6756
JANTXV2N6756
THRU-HOLE (TO-204AA/AE) [REF:MIL-PRF-19500/542]
100V, N-CHANNEL
Product Summary
Part Number BVDSS RDS(on) ID
IRF130
100V 0.18Ω 14A
The HEXFETtechnology is the key to International
Rectifier’s advanced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest
“State of the Art” design achieves: very low on-state resis-
tance combined with high transconductance; superior re-
verse energy and diode recovery dv/dt capability.
The HEXFET transistors also feature all of the well estab-
lished advantages of MOSFETs such as voltage control,
very fast switching, ease of paralleling and temperature
stability of the electrical parameters.
They are well suited for applications such as switching
power supplies, motor controls, inverters, choppers, audio
amplifiers and high energy pulse circuits.
TO-3
Features:
n Repetitive Avalanche Ratings
n Dynamic dv/dt Rating
n Hermetically Sealed
n Simple Drive Requirements
n Ease of Paralleling
Absolute Maximum Ratings
ID @ VGS =0V, TC = 25°C
ID @ VGS = 0V, TC = 100°C
IDM
PD @ TC = 25°C
Parameter
Continuous Drain Current
Continuous Drain Current
Pulsed Drain Current ➀
Max. Power Dissipation
Linear Derating Factor
VGS
EAS
IAR
EAR
dv/dt
Gate-to-Source Voltage
Single Pulse Avalanche Energy ➁
Avalanche Current ➀
Repetitive Avalanche Energy ➀
Peak Diode Recovery dv/dt ➂
TJ
TSTG
Operating Junction
Storage Temperature Range
Lead Temperature
Weight
Units
14
9.0 A
56
75 W
0.60
W/°C
±20 V
75 mJ
14 A
7.5 mJ
5.5 V/ns
-55 to 150
oC
300 (0.063 in. (1.6mm) from case for 10s)
11.5(typical)
g
For footnotes refer to the last page
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1
01/22/01
IRF130
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter
Min Typ Max Units
Test Conditions
BVDSS
Drain-to-Source Breakdown Voltage
100 — — V
VGS = 0V, ID = 1.0mA
∆BVDSS/∆TJ Temperature Coefficient of Breakdown — 0.13 — V/°C Reference to 25°C, ID = 1.0mA
Voltage
RDS(on)
Static Drain-to-Source On-State
Resistance
— — 0.18
— — 0.21 Ω
VGS = 10V, ID = 9.0A➃
VGS = 10V, ID =14A➃
VGS(th)
gfs
Gate Threshold Voltage
Forward Transconductance
2.0 — 4.0 V
4.6 — — S ( )
VDS = VGS, ID =250µA
VDS > 15V, IDS = 9.0A➃
IDSS
Zero Gate Voltage Drain Current
— — 25
— — 250 µA
VDS=80V, VGS=0V
VDS = 80V
VGS = 0V, TJ = 125°C
IGSS
IGSS
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
— — 100 nA
— — -100
VGS = 20V
VGS = -20V
Qg Total Gate Charge
12 — 35
VGS =10V, ID=14A
Qgs Gate-to-Source Charge
2.5 — 10 nC
VDS = 50V
Qgd
Gate-to-Drain (‘Miller’) Charge
5.0 — 15
td(on)
tr
td(off)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
— — 35
— — 80
ns
— — 60
VDD =50V, ID =14A,
RG =7.5Ω
tf Fall Time
— — 45
LS + LD
Total Inductance
— 6.1 — n H Measured from drain lead (6mm/0.25in. from
package) to source lead (6mm/0.25in. from
package)
Ciss Input Capacitance
Coss Output Capacitance
Crss Reverse Transfer Capacitance
— 650
— 250 —
— 44 —
pF
VGS = 0V, VDS = 25V
f = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
IS Continuous Source Current (Body Diode)
ISM Pulse Source Current (Body Diode) ➀
——
——
14
56
A
Test Conditions
VSD
trr
QRR
ton
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
— — 1.5 V
— — 300 nS
— — 3.0 µC
Tj = 25°C, IS = 14A, VGS = 0V ➃
Tj = 25°C, IF = 14A, di/dt ≤ 100A/µs
VDD ≤ 50V ➃
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
RthJC
RthJA
Junction to Case
Junction to Ambient
For footnotes refer to the last page
2
Min Typ Max Units
— — 1.67
°C/W
— — 30
Test Conditions
Typical socket mount
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