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PDF BCX55 Data sheet ( Hoja de datos )
| Número de pieza | BCX55 | |
| Descripción | NPN medium power transistors | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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BCP55; BCX55; BC55PA
60 V, 1 A NPN medium power transistors
Rev. 8 — 24 October 2011
Product data sheet
1. Product profile
1.1 General description
NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview
Type number[1]
Package
NXP
BCP55
SOT223
BCX55
SOT89
BC55PA
SOT1061
JEITA
SC-73
SC-62
-
[1] Valid for all available selection groups.
JEDEC
-
TO-243
-
PNP complement
BCP52
BCX52
BC52PA
1.2 Features and benefits
High current
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
Leadless very small SMD plastic package with medium power capability (SOT1061)
AEC-Q101 qualified
1.3 Applications
Linear voltage regulators
Low-side switches
Battery-driven devices
Power management
MOSFET drivers
Amplifiers
1.4 Quick reference data
Table 2. Quick reference data
Symbol Parameter
Conditions
Min Typ Max Unit
VCEO
IC
ICM
hFE
collector-emitter voltage
collector current
peak collector current
DC current gain
hFE selection -10
hFE selection -16
open base
single pulse; tp 1 ms
VCE = 2 V; IC = 150 mA
VCE = 2 V; IC = 150 mA
VCE = 2 V; IC = 150 mA
-
-
-
[1] 63
[1] 63
[1] 100
-
-
-
-
-
-
60 V
1A
2A
250
160
250
[1] Pulse test: tp 300 s; = 0.02.
1 page  
NXP Semiconductors
BCP55; BCX55; BC55PA
60 V, 1 A NPN medium power transistors
1.5
Ptot
(W)
1.0
0.5
(1)
(2)
(3)
006aac674
1.5
Ptot
(W)
1.0
(1)
(2)
(3)
0.5
006aac675
0.0
–75
–25
25
75 125 175
Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 1. Power derating curves SOT223
2.0
Ptot
(W)
1.5
1.0
0.5
(1)
(2)
(3)
(4)
(5)
0.0
–75
–25
25
75 125 175
Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 2. Power derating curves SOT89
006aac676
0.0
–75
–25
25
75
(1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2
(2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm2
(3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm2
(4) FR4 PCB, 4-layer copper, standard footprint
(5) FR4 PCB, single-sided copper, standard footprint
Fig 3. Power derating curves SOT1061
125 175
Tamb (°C)
BCP55_BCX55_BC55PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 24 October 2011
© NXP B.V. 2011. All rights reserved.
5 of 22
5 Page 
NXP Semiconductors
BCP55; BCX55; BC55PA
60 V, 1 A NPN medium power transistors
103
Zth(j-a)
(K/W)
102
10
duty cycle = 1
0.5
0.25
0.75
0.33
0.2
0.1
0.05
006aac685
10
0.02
0.01
10–1
10–5
10–4
10–3
10–2
10–1
1
10 102 103
tp (s)
FR4 PCB, single-sided copper, mounting pad for collector 6 cm2
Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;
typical values
103
Zth(j-a)
(K/W)
102
10
duty cycle = 1
0.5
0.25
0.75
0.33
0.2
0.1
0.05
0.02
10
0.01
006aac686
10–1
10–5
10–4
10–3
10–2
10–1
1
10 102 103
tp (s)
FR4 PCB, 4-layer copper, standard footprint
Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;
typical values
BCP55_BCX55_BC55PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 24 October 2011
© NXP B.V. 2011. All rights reserved.
11 of 22
11 Page | ||
| Páginas | Total 22 Páginas | |
| PDF Descargar | [ Datasheet BCX55.PDF ] | |
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