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PDF BD546C Data sheet ( Hoja de datos )

Número de pieza BD546C
Descripción PNP SILICON POWER TRANSISTORS
Fabricantes Power Innovations Limited 
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No Preview Available ! BD546C Hoja de datos, Descripción, Manual

Copyright © 1997, Power Innovations Limited, UK
BD546, BD546A, BD546B, BD546C
PNP SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
q Designed for Complementary Use with the
BD545 Series
q 85 W at 25°C Case Temperature
q 15 A Continuous Collector Current
q Customer-Specified Selections Available
B
C
SOT-93 PACKAGE
(TOP VIEW)
1
2
E3
Pin 2 is in electrical contact with the mounting base.
MDTRAA
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
Collector-base voltage (IE = 0)
RATING
Collector-emitter voltage (IB = 0) (see Note 1)
Emitter-base voltage
Continuous collector current
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)
Operating free air temperature range
Operating junction temperature range
Storage temperature range
Lead temperature 3.2 mm from case for 10 seconds
BD546
BD546A
BD546B
BD546C
BD546
BD546A
BD546B
BD546C
NOTES: 1. These values apply when the base-emitter diode is open circuited.
2. Derate linearly to 150°C case temperature at the rate of 0.68 W/°C.
3. Derate linearly to 150°C free air temperature at the rate of 28 mW/°C.
SYMBOL
VCBO
VCEO
VEBO
IC
Ptot
Ptot
TA
Tj
Tstg
TL
VALUE
-40
-60
-80
-100
-40
-60
-80
-100
-5
-15
85
3.5
-65 to +150
-65 to +150
-65 to +150
260
UNIT
V
V
V
A
W
W
°C
°C
°C
°C
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1

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BD546C pdf
BD546, BD546A, BD546B, BD546C
PNP SILICON POWER TRANSISTORS
JUNE 1973 - REVISED MARCH 1997
MECHANICAL DATA
SOT-93
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
SOT-93
ø 4,1
4,0
15,2
14,7
3,95
4,15
4,90
4,70
1,37
1,17
12,2 MAX.
16,2 MAX.
18,0 TYP.
31,0 TYP.
1
1,30
1,10
23
11,1
10,8
2,50 TYP.
0,78
0,50
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: The centre pin is in electrical contact with the mounting tab.
PRODUCT INFORMATION
MDXXAW
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