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Semtech Corporation |
SX1231J
WIRELESS & SENSING
SX1231J Transceiver
Low Power Integrated UHF Transceiver
DATASHEET
RFIO
VBAT1&2
VR_ANA
VR_DIG
Power Distribution System
LNA
Σ/Δ
Single to
Mixers
Modulators
Differential
RC
Oscillator
GND
VR_PA
PA_BOOST
PA0
Ramp &
Control
PA1&2
Tank
Inductor
Loop
Filter
Division by
2, 4 or 6
Frac-N PLL
Synthesizer
XO
32 MHz
XTAL
RSSI
AFC
GND
RESET
SPI
RXTX
DIO0
DIO1
DIO2
DIO3
DIO4
DIO5
GENERAL DESCRIPTION
The SX1231J is an ARIB compliant highly integrated RF
transceiver which operates over all Japanese sub-GHz
frequency bands. Its highly integrated digital architecture
minimizes external components and provides flexibility for
optimizing the system parameters and performance. The
high sensitivity and exceptional blocking performance
combined with optimized IIP3 maximizes the range in
harshest environments. The industries lowest sleep current,
fastest wake times, and low receive current extend the
battery life for any application. The transmit output power is
programmable up to +17dBm and delivers constant
performance over the battery voltage lifetime. TrueRF™
technology enables a low-cost external component count
(eliminating SAW filter) while still satisfying ARIB, FCC, and
ETSI regulations. The device supports IEEE 15.4d/g
mandatory modes.
APPLICATIONS
Smart metering and IEEE15.4d/g
Wireless sensor networks
Home and building automation
Wireless alarm and security systems
Industrial monitoring and control
Active RFID tags
Remote keyless entry (RKE) and automotive
KEY PRODUCT FEATURES
High Sensitivity: down to -120 dBm at 1.2 kbps
Robust Selectivity: 42dB at 25kHz offset
Bullet-proof front end: IIP3 = -18 dBm, IIP2 = +35 dBm,
80 dB Blocking Immunity, no Image Frequency response
Low current receive mode = 16 mA
Low current sleep mode with register retention =100nA
Programmable TX Power: -18 to +17 dBm in 1dB steps
Constant RF performance over VDD voltage range
FSK bit rates up to 300 kb/s
Fully integrated synthesizer with a resolution of 61 Hz
FSK, GFSK, MSK, GMSK and OOK modulations
Built-in bit synchronizer for clock recovery
Incoming sync word recognition
115 dB+ dynamic range RSSI
Automatic RF sense with ultra-fast AFC
Packet engine with CRC, AES-128, and 66-byte FIFO
Built-in temperature sensor and low battery indicator
ORDERING INFORMATION
Part Number Package Delivery MOQ / Multiple
MARKETS
Japan: ARIB STD-T67 from 426 to 470 MHz
Japan: ARIB STD-T108 from 915 to 930 MHz
SX1231JIMLTRT QFN24
Tape &
Reel
3000 pieces
Pb-free, Halogen free, RoHS/WEEE compliant product
Rev 2 - April 2012
Page 1
www.semtech.com
SX1231J
WIRELESS & SENSING
DATASHEET
Table of Contents
Page
1. General Description ................................................................................................................................................ 5
1.1. Simplified Block Diagram ................................................................................................................................ 5
1.2. Pin and Marking Diagram ................................................................................................................................ 6
1.3. Pin Description ................................................................................................................................................ 7
2. Electrical Characteristics......................................................................................................................................... 8
2.1. ESD Notice...................................................................................................................................................... 8
2.2. Absolute Maximum Ratings ............................................................................................................................ 8
2.3. Operating Range............................................................................................................................................. 8
2.4. Chip Specification ........................................................................................................................................... 9
2.4.1. Power Consumption ................................................................................................................................... 9
2.4.2. Frequency Synthesis .................................................................................................................................. 9
2.4.3. Receiver ................................................................................................................................................... 10
2.4.4. Transmitter ............................................................................................................................................... 11
2.4.5. Digital Specification ...................................................................................................................................12
3. Chip Description.................................................................................................................................................... 13
4. Configuration and Status Registers ...................................................................................................................... 13
4.1. General Description ...................................................................................................................................... 13
4.2. Common Configuration Registers ................................................................................................................. 16
4.3. Transmitter Registers .................................................................................................................................... 19
4.4. Receiver Registers ........................................................................................................................................ 20
4.5. IRQ and Pin Mapping Registers.................................................................................................................... 22
4.6. Packet Engine Registers............................................................................................................................... 24
4.7. Temperature Sensor Registers ..................................................................................................................... 27
4.8. Test Registers ............................................................................................................................................... 27
5. Application Information ......................................................................................................................................... 28
5.1. Reference Design ......................................................................................................................................... 28
5.2. Regulatory Compliance................................................................................................................................. 30
5.2.1. ARIB STD-T67 ......................................................................................................................................... 30
5.2.2. ARIB STD-T108 ....................................................................................................................................... 30
6. Packaging Information .......................................................................................................................................... 31
6.1. QFN 24 Encapsulation .................................................................................................................................. 31
6.2. Thermal Impedance ...................................................................................................................................... 31
6.3. Tape & Reel Specification............................................................................................................................. 32
7. References............................................................................................................................................................ 33
8. Revision History .................................................................................................................................................... 33
Rev 2 - April 2012
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