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PDF ZICM357P2-1 Data sheet ( Hoja de datos )
| Número de pieza | ZICM357P2-1 | |
| Descripción | Ember EM357 Transceiver Based Module | |
| Fabricantes | CEL | |
| Logotipo |  |
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DATA SHEET
MeshConnect™ EM357 Module
ZICM357P2-1
Ember EM357 Transceiver Based Module
Integrated Transceiver Modules for ZigBee / IEEE 802.15.4
Development Kit available: ZICM357P2-KIT1-1
DESCRIPTION
CEL’s MeshConnect™ EM357 Module combines high perfor-
mance RF solution with the market's premier ZigBee stack.
The addition of on board memory enables Over-The-Air (OTA)
programming without the need for additional in system memory.
The integrated power amplifier maximizes range and perfor-
mance. The small module footprint makes it suitable for a wide
range of ZigBee applications. The MeshConnect EM357 mod-
ule is certified and qualified enabling customers to accelerate
time to market by greatly reducing the design and certification
phases of development.
CEL’s MeshConnect™ EM357 module (ZICM357P2-1) is
based on the Ember EM357 Zigbee compliant SOC IC. The IC
is a single-chip solution, compliant with ZigBee specifications
and IEEE 802.15.4, a complete wireless solution for all ZigBee
applications. The IC consists of an RF transceiver with the
baseband modem, a hardwired MAC and an embedded 32-bit
ARM® Cortex™-M3 microcontroller with internal RAM (12kB)
and Flash (192kB) memory. The device provides numerous
general-purpose I/O pins and peripheral functions such as
timers and UARTs.
The MeshConnect EM357 module adds a power amplifier (PA)
to increase range up to 2.5 miles, provide more reliable trans-
mission, and reduce the number of nodes in your network. It is
especially useful for open outdoor applications where the nodes
are physically far apart or for indoor use where the nodes have
to operate in a noisy RF environment. The Module’s outstand-
ing 120dB link budget ensures high quality connections even in
such harsh environments.
The MeshConnect EM357 module also integrates an 1MB
Flash memory for Over-The-Air program updates, making this
device ready for Smart Energy Applications.
MeshConnect™ EM357 Module
• FLASH Memory:
192 kB (EM357 internal)
1MB (on module board)
• 12 kB SRAM
• 32-bit ARM® Cortex™-M3
• Up to 23 GPIO Pins
• SPI (Master/Slave), TWI, UART
• Timers, Serial Wire/JTAG Interface
• 5-channel 14-bit ADC
• Transmit power +20dBm
• 1MB additional flash for Over-The-Air programming
• +120 dB RF link budget
• Range up to 2.5 miles
FEATURES
• High RF performance:
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Up to 120 dB RF Link Budget
RX Sensitivity: -100 dBm
RF TX Power: +20 dBm
• Data Rate: 250 kbps
• Small footprint: 1” x 1.41”
(25.4 mm x 35.9 mm)
• Advanced Power Management
Scheme w/ Deep Sleep Mode
• Integrated PCB trace antenna
Optional U.FL external Antenna
• 15 RF channels
• Up to 13,000 feet of range
• AES encryption
• FCC, CE and IC certifications
• ROHS compliant
APPLICATIONS
• Smart Energy / Grid Markets
Smart Meters
• Building automation and control
• Home automation and control
Thermostats
Displays
Energy Management
Security Devices
HVAC control
Lighting control
• General ZigBee wireless
sensor networking
ORDERING INFORMATION
Part Number
MeshConnect™
EM357 Module
Order Number
ZICM357P2-1
ZICM357P2-1C
ZICM357P2-KIT1-1
Description
+20 dBm Output power, PCB Trace antenna
+20 dBm Output power, with U.FL Connector for external antenna
+20 dBm Engineering Development Kit
The information in this document is subject to change without notice, please confirm data is current
Document No: 0008-00-07-00-000 (Issue A)
Date Published: January 21, 2011
Page 1
Datasheet pdf - http://www.DataSheet4U.net/
1 page  
MeshConnect™ EM357 Module
ABSOLUTE MAXIMUM RATINGS
Description
Power Supply Voltage (VDD)
Voltage on any I/O Line
RF Input Power
Storage Temperature Range
Reflow Soldering Temperature
MeshConnect™ EM357 Module
Min Max
-0.3 3.6
-0.3 VDD + 0.3
– 15
-40 125
– 260
Unit
VDC
VDC
dBm
°C
°C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description
Power Supply Voltage (VDD)
Input Frequency
Ambient Temperature Range
MeshConnect™ EM357 Module
Min Typ Max
2.7 3.3 3.6
2405
– 2475
-40 25 85
Unit
V
MHz
°C
DC CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted)
Description
Transmit Mode Current
Receive Mode Current
Sleep Mode Current
MeshConnect™ EM357 Module
Min Typ Max
– 170 –
– 28 –
–
6
www.DataSheet.co.kr
–
Unit
mA
mA
µA
RF CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted)
Description
MeshConnect™ EM357 Module
Min Typ Max
Unit
General Characteristics
RF Frequency Range
RF Channels
Frequency Error Tolerance
2405
11
-96.2
–
2475
MHz
– 25 –
– 96.2 kHz
Transmitter
Maximum Output Power
Minimum Output Power
Offset Error Vector Magnitude
Receiver
Sensitivity (1% PER, boost mode)
Sensitivity (1% PER, normal mode)
Saturation (maximum input level)
– 20 – dBm
– -40 – dBm
–
15 35
%
– -100 -94 dBm
– -98 -92 dBm
0 – – dBm
Page 5
Datasheet pdf - http://www.DataSheet4U.net/
5 Page 
MeshConnect™ EM357 Module
PROCESSING
Recommended Reflow Profile
Parameters Values
Ramp up rate (from Tsoakmax to Tpeak)
Minimum Soak Temperature
Maximum Soak Temperature
Soak Time
TLiquidus
Time above TL
Tpeak
Time within 5º of Tpeak
Time from 25º to Tpeak
Ramp down rate
3º/sec max
150ºC
200ºC
60-120 sec
217ºC
60-150 sec
250ºC
20-30 sec
8 min max
6ºC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Speci-
fication. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
www.DataSheet.co.kr
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which
is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Page 11
Datasheet pdf - http://www.DataSheet4U.net/
11 Page | ||
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