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PDF TJA1040T Data sheet ( Hoja de datos )
| Número de pieza | TJA1040T | |
| Descripción | High speed CAN transceiver | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TJA1040
High speed CAN transceiver
Product specification
Supersedes data of 2003 Feb 19
2003 Oct 14
1 page  
Philips Semiconductors
High speed CAN transceiver
Product specification
TJA1040
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
VCC supply voltage
VTXD
VRXD
VSTB
VCANH
VCANL
VSPLIT
Vtrt
Vesd
DC voltage on pin TXD
DC voltage on pin RXD
DC voltage on pins STB
DC voltage on pin CANH
DC voltage on pin CANL
DC voltage on pin SPLIT
transient voltages on pins CANH,
CANL and SPLIT
electrostatic discharge voltage
Tvj virtual junction temperature
Tstg storage temperature
CONDITIONS
no time limit
operating range
0 < VCC < 5.25 V; no time limit
0 < VCC < 5.25 V; no time limit
0 < VCC < 5.25 V; no time limit
according to ISO 7637; see Fig.5
MIN.
−0.3
4.75
−0.3
−0.3
−0.3
−27
−27
−27
−200
Human Body Model (HBM); note 1
pins CANH and CANL
and SPLIT
−6
all other pins
−4
Machine Model (MM); note 2
−200
note 3
−40
−55
MAX.
UNIT
+6 V
5.25 V
VCC + 0.3
VCC + 0.3
VCC + 0.3
+40
V
V
V
V
+40 V
+40 V
+200
V
+6
+4
+200
+150
+150
kV
kV
V
°C
°C
Notes
1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.
2. Equivalent to discharging a 200 pF capacitor via a 0.75 µH series inductor and a 10 Ω series resistor.
3. Junction temperature in accordance with IEC 60747-1. An alternative definition of Tvj is: Tvj = Tamb + P × Rth(vj-amb),
where Rth(vj-amb) is a fixed value to be used for the calculating of Tvj. The rating for Tvj limits the allowable
combinations of power dissipation (P) and ambient temperature (Tamb).
THERMAL CHARACTERISTICS
In accordance with IEC 60747-1.
SYMBOL
Rth(vj-a)
Rth(vj-s)
PARAMETER
thermal resistance from virtual junction
to ambient in SO8 package
thermal resistance from virtual junction
to substrate of bare die
CONDITIONS
in free air
in free air
VALUE
145
50
UNIT
K/W
K/W
QUALITY SPECIFICATION
Quality specification in accordance with “AEC-Q100”.
2003 Oct 14
5
5 Page 
Philips Semiconductors
High speed CAN transceiver
Product specification
TJA1040
BONDING PAD LOCATIONS
SYMBOL
TXD
GND
VCC
RXD
SPLIT
CANL
CANH
STB
PAD
1
2
3
4
5
6
7
8
COORDINATES(1)
xy
119.5
648.5
1 214.25
1 635.25
1 516.5
990.5
530.25
113.75
114.5
85
114.5
114.5
1 275
1 273.75
1 273.75
1 246
Note
1. All x/y coordinates represent the position of the centre
of each pad (in µm) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).
handbook, halfpage 8 7 6
5
TJA1040U
test pad 1
test pad 2
x
01
0
2
34
MBL584
y
The backside of the bare die must be connected to ground.
Fig.9 Bonding pad locations.
2003 Oct 14
11
11 Page | ||
| Páginas | Total 17 Páginas | |
| PDF Descargar | [ Datasheet TJA1040T.PDF ] | |
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