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74ALVCH16500 반도체 회로 부품 판매점

18-bit universal bus transceiver 3-State



NXP Semiconductors 로고
NXP Semiconductors
74ALVCH16500 데이터시트, 핀배열, 회로
INTEGRATED CIRCUITS
74ALVCH16500
18-bit universal bus transceiver (3-State)
Product specification
Supersedes data of 1998 Aug 31
IC24 Data Handbook
1998 Sep 24
Philips
Semiconductors


74ALVCH16500 데이터시트, 핀배열, 회로
Philips Semiconductors
18-bit universal bus transceiver (3-State)
Product specification
74ALVCH16500
FEATURES
Complies with JEDEC standard no. 8-1A
CMOS low power consumption
Direct interface with TTL levels
Current drive ± 24 mA at 3.0 V
All inputs have bushold circuitry
Output drive capability 50transmission lines @ 85°C
MULTIBYTETM flow-through standard pin-out architecture
Low inductance multiple VCC and ground pins for minimum noise
and ground bounce
DESCRIPTION
The 74ALVCH16500 is a high-performance CMOS product.
This device is an 18-bit universal transceiver featuring non-inverting
3-State bus compatible outputs in both send and receive directions.
Data flow in each direction is controlled by output enable (OEAB and
OEBA), latch enable (LEAB and LEBA), and clock (CPAB and CPBA)
inputs. For A-to-B data flow, the device operates in the transparent
mode when LEAB is High. When LEAB is Low, the A data is latched if
CPAB is held at a High or Low logic level. If LEAB is Low, the A-bus
data is stored in the latch/flip-flop on the High-to-Low transition of
CPAB. When OEAB is High, the outputs are active. When OEAB is
Low, the outputs are in the high-impedance state.
Data flow for B-to-A is similar to that of A-to-B but uses OEBA, LEBA
and CPBA. The output enables are complimentary (OEAB is active
High, and OEBA is active Low).
To ensure the high impedance state during power up or power
down, OEBA should be tied to VCC through a pullup resistor and
OEAB should be tied to GND through a pulldown resistor; the
minimum value of the resistor is determined by the
current-sinking/current-sourcing capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data
inputs at a valid logic level.
QUICK REFERENCE DATA
GND = 0V; Tamb = 25°C; tr = tf = 2.5ns
SYMBOL
PARAMETER
CONDITIONS
TYPICAL UNIT
tPHL/tPLH
Propagation delay
An, Bn to Bn, An
VCC = 2.5V, CL = 30pF
VCC = 3.3V, CL = 50pF
CI/O Input/output capacitance
CI Input capacitance
Outputs enabled
CPD
Power dissipation capacitance per latch VI = GND to VCC1
Outputs disabled
NOTES:
1. CPD is used to determine the dynamic power dissipation (PD in µW):
PD = CPD × VCC2 × fi + S (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacitance in pF;
fo = output frequency in MHz; VCC = supply voltage in V; S (CL × VCC2 × fo) = sum of outputs.
3.1
2.9
8.0
4.0
21
3
ns
pF
pF
pF
ORDERING INFORMATION
PACKAGES
56-Pin Plastic TSSOP Type II
TEMPERATURE RANGE
–40°C to +85°C
OUTSIDE NORTH AMERICA
74ALVCH16500 DGG
DWG NUMBER
SOT364-1
1998 Sep 24
2 8533-2125 20079




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74ALVCH16500 transceiver

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