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![]() Fairchild Semiconductor |
![]() October 2001
Revised October 2001
74ALVC16601
Low Voltage 18-Bit Universal Bus Transceivers
with 3.6V Tolerant Inputs and Outputs
General Description
The ALVC16601 is an 18-bit universal bus transceiver
which combines D-type latches and D-type flip-flops to
allow data flow in transparent, latched, and clocked modes.
Data flow in each direction is controlled by output-enable
(OEAB and OEBA), latch-enable (LEAB and LEBA), and
clock (CLKAB and CLKBA) inputs. The clock can be con-
trolled by the clock-enable (CLKENAB and CLKENBA)
inputs. For A-to-B data flow, the device operates in the
transparent mode when LEAB is HIGH. When LEAB is
LOW, the A data is latched if CLKAB is held at a HIGH-to-
LOW logic level. If LEAB is LOW, the A bus data is stored
in the latch/flip-flop on the LOW-to-HIGH transition of
CLKAB. When OEAB is LOW, the outputs are active. When
OEAB is HIGH, the outputs are in the high-impedance
state.
Data flow for B to A is similar to that of A to B but uses
OEBA, LEBA, CLKBA and CLKENBA.
The ALVC16601 is designed for low voltage (1.65V to
3.6V) VCC applications with I/O capability up to 3.6V.
The ALVC16601 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
s 1.65V–3.6V VCC supply operation
s 3.6V tolerant inputs and outputs
s tPD (A to B, B to A)
3.4 ns max for 3.0V to 3.6V VCC
4.0 ns max for 2.3V to 2.7V VCC
7.0 ns max for 1.65V 1.95V VCC
s Power-down high impedance inputs and outputs
s Supports live insertion/withdrawal (Note 1)
s Uses patented noise/EMI reduction circuitry
s Latchup conforms to JEDEC JED78
s ESD performance:
Human body model > 2000V
Machine model >200V
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Note 1: To ensure the high-impedance state during power up or power
down, OE should be tied to VCC through a pull-up resistor; the minimum
value of the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Order Number Package Number
Package Description
74ALVC16601GX
(Note 2)
BGA54A
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
(Preliminary) [TAPE and REEL]
74ALVC16601MTD
(Note 3)
MTD56
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 2: BGA package available in Tape and Reel only.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
© 2001 Fairchild Semiconductor Corporation DS500682
www.fairchildsemi.com
![]() Connection Diagrams
Pin Assignment for TSSOP
Pin Assignment for FBGA
(Top Thru View)
Pin Descriptions
Pin Names
Description
OEAB, OEBA
Output Enable Inputs (Active LOW)
LEAB, LEBA
Latch Enable Inputs
CLKAB, CLKBA
Clock Inputs
CLKENAB, CLKENBA Clock Enable Inputs
A1–A18
B1–B18
Side A Inputs or 3-STATE Outputs
Side B Inputs or 3-STATE Outputs
FBGA Pin Assignments
123 4 5
A A2 A1 OEAB CLKENAB B1
B A4 A3 LEAB CLKAB B3
C A6 A5 VCC VCC
B5
D A8 A7 GND GND B7
E A10 A9 GND GND
B9
F
A12 A11 GND
GND
B11
G A14 A13 VCC
VCC
B13
H A16 A15 OEBA CLKBA B15
J A17 A18 LEBA CLKENBA B18
Truth Table
(Note 4)
6
B2
B4
B6
B8
B10
B12
B14
B16
B17
Inputs
Outputs
CLKENAB OEAB LEAB CLKAB An
Bn
X
HX
XX
Z
X
LH
XL
L
X
LH
XH
H
H
LL
X X B0 (Note 5)
H
LL
X X B0 (Note 5)
L
LL
↑L
L
L
LL
↑H
H
L
LL
L X B0 (Note 5)
L
LL
HX
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial (HIGH or LOW, inputs may not float)
Z = High Impedance
B0 (Note 6)
Note 4: A-to-B data flow is shown; B-to-A flow is similar but uses OEBA,
LEBA, CLKBA, and CLKENBA.
Note 5: Output level before the indicated steady-state input conditions
were established.
Note 6: Output level before the indicated steady-state input conditions
were established, provided that CLKAB was HIGH before LEAB went LOW.
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