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LIS3DSH 반도체 회로 부품 판매점

MEMS digital output motion sensor



STMicroelectronics 로고
STMicroelectronics
LIS3DSH 데이터시트, 핀배열, 회로
LIS3DSH
MEMS digital output motion sensor:
ultra-low-power high-performance three-axis "nano" accelerometer
Datasheet - production data
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Features
Wide supply voltage, 1.71 V to 3.6 V
Independent IOs supply (1.8 V) and supply
voltage compatible
Ultra-low power consumption
 2g/±4g/6g/8g/16g dynamically selectable
full scale
I2C/SPI digital output interface
16-bit data output
Programmable embedded state machines
Embedded temperature sensor
Embedded self-test
Embedded FIFO
10000 g high shock survivability
ECOPACK®, RoHS and “Green” compliant
Applications
Motion-controlled user interface
Gaming and virtual reality
Pedometers
Intelligent power saving for handheld devices
Display orientation
Click/double-click recognition
Impact recognition and logging
Vibration monitoring and compensation
Description
The LIS3DSH is an ultra-low-power high-
performance three-axis linear accelerometer
belonging to the “nano” family with an embedded
state machine that can be programmed to
implement autonomous applications.
The LIS3DSH has dynamically selectable full
scales of 2g/±4g/6g/8g/16g and is capable of
measuring accelerations with output data rates
from 3.125 Hz to 1.6 kHz.
The self-test capability allows the user to check
the functioning of the sensor in the final
application.
The device can be configured to generate
interrupt signals activated by user-defined motion
patterns.
The LIS3DSH has an integrated first-in, first-out
(FIFO) buffer allowing the user to store data in
order to limit intervention by the host processor.
The LIS3DSH is available in a small thin plastic
land grid array package (LGA) and is guaranteed
to operate over an extended temperature range
from -40 °C to +85 °C.
Table 1. Device summary
Order
codes
Temperature
range [C]
Package
Packaging
LIS3DSHTR -40 to +85
LGA-16
Tape and
reel
October 2015
This is information on a product in full production.
DocID022405 Rev 2
1/53
www.st.com


LIS3DSH 데이터시트, 핀배열, 회로
Contents
Contents
LIS3DSH
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . 12
2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.1
2.3.2
SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
I2C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.5 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.5.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.5.2 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.6 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.6.1 Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.7 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.8 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.9 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4 Digital main blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 State machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.1 Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.2 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.3 Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.4 Stream-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.5 Retrieving data from FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2/53 DocID022405 Rev 2




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LIS3DSH sensor

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MEMS digital output motion sensor - STMicroelectronics