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PDF L3G4200DH Data sheet ( Hoja de datos )
| Número de pieza | L3G4200DH | |
| Descripción | MEMS motion sensor: three-axis digital output gyroscope | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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L3G4200DH
MEMS motion sensor:
three-axis digital output gyroscope
Preliminary data
Features
■ Three selectable full scales (250/500/2000
dps)
■ I2C/SPI digital output interface
■ 16 bit-rate value data output
■ 8-bit temperature data output
■ Two digital output lines (interrupt and data
ready)
■ Integrated low- and high-pass filters with user-
selectable bandwidth
■ Embedded self-test
■ Wide supply voltage: 2.4 V to 3.6 V
■ Low voltage-compatible IOs (1.8 V)
■ Embedded power-down and sleep mode
■ Embedded temperature sensor
■ 96 levels of 16-bit data output (FIFO)
■ High shock survivability
■ Extended operating temperature range (-40 °C
to +85 °C)
■ ECOPACK® RoHS and “Green” compliant
(see Section 5)
Applications
■ Gaming and virtual reality input devices
■ Motion control with MMI (man-machine
interface)
■ GPS navigation systems
■ Appliances and robotics
LGA-16 (4x4x1.1 mm)
Description
The L3G4200DH is a low-power three-axis
angular rate sensor.
It includes a sensing element and an IC interface
capable of providing the measured angular rate to
the external world through a digital interface
(I2C/SPI).
The sensing element is manufactured using a
dedicated micro-machining process developed by
STMicroelectronics to produce inertial sensors
and actuators on silicon wafers.
The IC interface is manufactured using a CMOS
process that allows a high level of integration to
design a dedicated circuit which is trimmed to
better match the sensing element characteristics.
The L3G4200DH has a full scale of ±250/±500/
±2000 dps and is capable of measuring rates with
a user-selectable bandwidth.
The L3G4200DH is available in a plastic land grid
array (LGA) package and can operate within a
temperature range from -40 °C to +85 °C.
Table 1. Device summary
Order code
Temperature range (°C)
L3G4200DH
-40 to +85
L3G4200DHTR
-40 to +85
Package
LGA-16 (4x4x1.1 mm)
LGA-16 (4x4x1.1 mm)
Packing
Tray
Tape and reel
April 2010
Doc ID 17300 Rev 1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
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1 page  
L3G4200DH
List of figures
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List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
L3G4200DH external low-pass filter values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
I2C slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Bypass-to-stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trigger stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Multiple byte SPI read protocol (2-byte example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Multiple byte SPI write protocol (2-byte example). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SPI read protocol in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
LGA-16: mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Doc ID 17300 Rev 1
5/28
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L3G4200DH
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Mechanical and electrical specifications
2.4
2.4.1
Communication interface characteristics
SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Table 7. SPI slave timing values
Symbol
Parameter
Value(1)
Min.
Max.
Unit
tc(SPC)
fc(SPC)
tsu(CS)
th(CS)
tsu(SI)
th(SI)
tv(SO)
th(SO)
tdis(SO)
SPI clock cycle
SPI clock frequency
CS setup time
CS hold time
SDI input setup time
SDI input hold time
SDO valid output time
SDO output hold time
SDO output disable time
100 ns
10 MHz
5
8
5
15 ns
50
6
50
1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results; not
tested in production.
Figure 4. SPI slave timing diagram(b)
&6
63&
WVX &6
6',
WF 63&
WVX 6,
WK 6,
06%,1
WY 62
WK 62
WK &6
/6%,1
WGLV 62
6'2
06%287
/6%287
!-V
b. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output ports.
Doc ID 17300 Rev 1
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