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TMP121 반도체 회로 부품 판매점

(TMP121 / TMP123) 1.5C Accurate Digital Temperature Sensor



Burr-Brown Corporation 로고
Burr-Brown Corporation
TMP121 데이터시트, 핀배열, 회로
TMP121
TMP123
SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
1.5°C Accurate Digital Temperature Sensor
with SPIInterface
FEATURES
D DIGITAL OUTPUT: SPI-Compatible Interface
D RESOLUTION: 12-Bit + Sign, 0.0625°C
www.DataSheet4UD.comACCURACY:
±1.5°C from −25°C to +85°C (max)
D LOW QUIESCENT CURRENT: 50µA (max)
D WIDE SUPPLY RANGE: 2.7V to 5.5V
D TINY SOT23-6 PACKAGE
D OPERATION TO 150°C
APPLICATIONS
D POWER-SUPPLY TEMPERATURE
MONITORING
D COMPUTER PERIPHERAL THERMAL
PROTECTION
D NOTEBOOK COMPUTERS
D CELL PHONES
D BATTERY MANAGEMENT
D OFFICE MACHINES
DESCRIPTION
The TMP121 and TMP123 are SPI-compatible tempera-
ture sensors available in the tiny SOT23-6 package.
Requiring no external components, the TMP121 and
TMP123 are capable of measuring temperatures within
2°C of accuracy over a temperature range of −40°C to
+125°C. Low supply current, and a supply range from 2.7V
to 5.5V, make the TMP121 and TMP123 excellent
candidates for low-power applications.
The TMP121 and TMP123 are ideal for extended thermal
measurement in a variety of communication, computer,
consumer, environmental, industrial, and instrumentation
applications.
Temperature
NC 1
Diode
Temp.
Sensor
Control
Logic
6 SO
Temperature
GND 1
Diode
Temp.
Sensor
Control
Logic
6 SO
GND 2
∆Σ
A/D
Converter
Serial
Interface
5 CS
NC 2
∆Σ
A/D
Converter
Serial
Interface
5 CS
V+ 3
OSC
Config.
and Temp.
Register
4 SCK
V+ 3
OSC
Config.
and Temp.
Register
4 SCK
TMP121
TMP123
NC = No Connection(1)
NC = No Connection(1)
(1) Pins labeled NC should be left floating or connected to GND.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters.
Copyright 2003−2005, Texas Instruments Incorporated
www.ti.com


TMP121 데이터시트, 핀배열, 회로
TMP121
TMP123
SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
Power Supply, V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltage(2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3V to +7V
Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +150°C
Storage Temperature Range . . . . . . . . . . . . . . . . . −60°C to +150°C
Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . . . . . +150°C
Lead Temperature (soldering) . . . . . . . . . . . . . . . . . . . . . . . . +300°C
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
www.DataShe(e2t)4IUnp.cuotmvoltage rating applies to all TMP121 and TMP123 input
voltages.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
TMP121
TMP123
SOT23-6
DBV
T121
T123
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATIONS
Top View
TMP121(1)
NC 1
GND 2
V+ 3
6 SO
5 CS
4 SCK
TMP123(1)
GND 1
NC 2
V+ 3
6 SO
5 CS
4 SCK
SOT23-6
SOT23−6
NC = No Connection(2)
SOT23−6
NC = No Connection(2)
Pin 1 orientation is determined by package marking.
(1) Pin 1 of the SOT23-6 package is determined by orienting the package marking as shown.
(2) Pins labeled NC should be left floating or connected to GND.
2




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