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Siemens Semiconductor Group |
Silicon Spreading Resistance Temperature Sensor in KT 110, KT 210,
Miniature Leaded Plastic Package
KTY 11, KTY 21
Features
• Temperature dependent Resistor with Positive
Temperature Coefficient
• Miniature plastic package for very small thermal time
constants
• Fast response
• High reliability due to multilayer gold contacts
• n-conducting silicon crystal
TO-92 Mini
• Polarity independent due to symmetrical construction
• Available selected in ± 1% tolerance groups (KTY-series)
Type
Marking Ordering Code
KT 110
KTY 11-5
KTY 11-6
KTY 11-7
KT 210
KTY 21-5
KTY 21-6
KTY 21-7
T-1
T-5
T-6
T-7
N-1
N-5
N-6
N-7
Q62705-K332
Q62705-K245
Q62705-K246
Q62705-K247
Q62705-K334
Q62705-K258
Q62705-K259
Q62705-K260
Pin Configuration
12
electrical electrical
contact contact
Package
TO-92 Mini
Absolute Maximum Ratings
Parameter
Maximum operating voltage 1)
TA ≤ 25 ˚C, t ≤ 10 ms
Maximum operating current
Peak operating current
TA ≤ 25 ˚C, t ≤ 10 ms
Operating temperature range
Storage temperature range
Symbol
Vopmax
KT 110 KT 210
KTY 11 KTY 21
25
Unit
V
Iopmax
Iopp
5
7
7 mA
10 mA
Top
− 50 … + 150
˚C
Tstg
− 50 … + 150
˚C
1) ESD Class 1. When the temperature sensor is operated with long supply leads, it should be protected through
the parallel connection of a > 10 nF capacitor to prevent damage to the sensor through induced voltage peaks.
Semiconductor Group
1
1997-09-30
KT 110, KT 210,
KTY 11, KTY 21
Electrical Characteristics
at TA = 25 ˚C unless otherwise specified
Parameter
Symbol
Temperature sensor resistance IB = 1 mA
KT 110
KTY 11-5
KTY 11-6
KTY 11-7
KT 210
KTY 21-5
KTY 21-6
KTY 21-7
R25
Thermal time constant (63% of ∆TA)
in still air
in still oil (Freon FC40/PP7)
τair
τoil
Limit Values
min. typ. max.
1940
1950
1980
2010
970
975
990
1005
–
–
–
–
–
–
–
–
2060
1990
2020
2050
1030
995
1010
1025
– 11 –
– 1.5 –
Unit
Ω
s
Package Outline
TO-92 Mini
2.1-0.2
12
1.7-0.2
Weight approx. 0.02 g
0.5 ±0.1
0.4 ±0.1
0.9 ±0.1
0.2
+0.07
-0.03
Dimensions in mm
Exterior Packaging
I.e. tubes, trays, boxes are shown in our Data Book “Package Information”.
Semiconductor Group
2
1997-09-30
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