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ANPEC |
APL5930
3A, Ultra Low Dropout (0.23V Typical) Linear Regulator
Features
General Description
• Compatible with APL5913
The APL5930 is a 3A ultra low dropout linear regulator.
• Ultra Low Dropout
The IC needs two supply voltages, one is a control voltage
- 0.23V(typical) at 3A Output Current
• Low ESR Output Capacitor (Multi-layer
Chip Capacitors (MLCC)) Applicable
• 0.8V Reference Voltage
• High Output Accuracy
(V ) for the control circuitry, the other is a main supply
CNTL
voltage (VIN) for power conversion, to reduce power dissi-
pation and provide extremely low dropout voltage.
The APL5930 integrates many functions. A Power-On-
Reset (POR) circuit monitors both supply voltages on
VCNTL and VIN pins to prevent erroneous operations.
- ±1.5% over Line, Load, and Temperature Range The functions of thermal shutdown and current-limit pro-
• Fast Transient Response
tect the device against thermal and current over-loads. A
• Adjustable Output Voltage
POK indicates the output voltage status with a delay time
• Power-On-Reset Monitoring on Both VCNTL and set internally. It can control other converter for power
VIN Pins
sequence. The APL5930 can be enabled by other power
• Internal Soft-Start
systems. Pulling and holding the EN voltage below 0.4V
• Current-Limit and Short Current-Limit Protections shuts off the output.
The APL5930 is available in a SOP-8P package which
• Thermal Shutdown with Hysteresis
features small size as SOP-8 and an Exposed Pad to
• Open-Drain VOUT Voltage Indicator (POK)
reduce the junction-to-case resistance to extend power
• Low Shutdown Quiescent Current (<30 µA)
range of applications.
• Shutdown/Enable Control Function
• Simple SOP-8P Package with Exposed Pad
Applications
• Lead Free and Green Devices Available
• Front Side Bus VTT (1.2V/3A)
(RoHS Compliant)
• Note Book PC Applications
• Motherboard Applications
Pin Configuration
Simplified Application Circuit
GND 1
FB 2
VOUT 3
VOUT 4
8 EN
7 POK
6 VCNTL
5 VIN
SOP-8P (Top View)
= Exposed Pad
(connected to VIN plane for better heat dissipation)
POK
EN
Enable
VCNTL
POK VIN
VOUT
APL5930
EN FB
GND
VCNTL
VIN
VOUT
Optional
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright © ANPEC Electronics Corp.
Rev. A.4 - Sep., 2009
1
www.anpec.com.tw
APL5930
Ordering and Marking Information
APL5930
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
KA : SOP-8P
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL5930 KA :
APL5930
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VIN VIN Supply Voltage (VIN to GND)
-0.3 ~ 4.0
V
VCNTL
VCNTL Supply Voltage (VCNTL to GND)
-0.3 ~ 7
V
VOUT
VOUT to GND Voltage
-0.3 ~ VIN +0.3
V
POK to GND Voltage
-0.3 ~ 7
V
EN, FB to GND Voltage
-0.3 ~ VCNTL +0.3
V
PD
TJ
TSTG
TSDR
Power Dissipation
Maximum Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
3
150
-65 ~ 150
260
W
oC
oC
oC
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
θJA
θJC
Parameter
Junction-to-Ambient Resistance in Free Air (Note 2)
Junction-to-Case Resistance in Free Air (Note 3)
SOP-8P
SOP-8P
Typical Value
42
18
Unit
oC/W
oC/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
of SOP-8P is soldered directly on the PCB.
Note 3: The “Thermal Pad Temperature” is measured on the PCB copper area connected to the thermal pad of package.
18
2 VIN 7
36
45
Measured Point
PCB Copper
Copyright © ANPEC Electronics Corp.
Rev. A.4 - Sep., 2009
2
www.anpec.com.tw
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