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PDF BD50HC0WEFJ Data sheet ( Hoja de datos )
| Número de pieza | BD50HC0WEFJ | |
| Descripción | 1A Fixed Output LDO Regulators | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
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Datasheet
1A Fixed Output
LDO Regulators
BDxxHC0WEFJ
●General Description
BDxxHC0WEFJ series devices are LDO regulators with an output current of 1.0A. The output accuracy is ±1% of the output
voltage. Various fixed output voltage devices that do not use external resistors are available. It can be used for a wide
range of digital appliance applications. It has a small package type: HTSOP-J8 (4.90mm x 6.00mm x 1.00mm). These
devices have built in over current protection to protect the device when output is shorted, 0µA shutdown mode and thermal
shutdown circuit to protect the device during over load conditions. These LDO regulators are usable with ceramic capacitors
that enable a smaller layout and longer life.
●Features
+/-1% output voltage accuracy
Built-in Over Current Protection circuit (OCP)
Built-in Thermal Shut Down circuit (TSD)
Zero μA shutdown mode
●Key Specifications
Input Power Supply Voltage range:
4.5V to 8.0V
Output voltage: 1.5V/1.8V/2.5V/3.0V/3.3V/5V/6V/7V
Output current:
1.0A(Max.)
Shutdown current:
0μA(Typ.)
Operating temperature range:
-25℃ to +85℃
●Package
HTSOP-J8
(Typ.) (Typ.) (Max.)
4.90mm x 6.00 mm x 1.00mm
●Typical Application Circuit
VCC
CIN
EN
VO
VO_S
GND FIN
CIN,COUT : Ceramic Capacitor
COUT
HTSOP-J8
○Product structure：Silicon monolithic integrated circuit
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･14･001
○This product is not designed protection against radioactive rays.
1/18
TSZ02201-0R6R0A600330-1-2
28.Dec.2012 Rev.002
Free Datasheet http://www.datasheet4u.com/
1 page  
BDxxHC0WEFJ
●Typical Performance Curves
(Unless otherwise noted, Ta=25℃, EN=3V, VCC=6V)
VO
IO
Fig.2
Transient Response
(0→1.0A)
Co=1µF
Datasheet
VO
IO
Fig.3
Transient Response
(1.0→0A)
Co=1µF
VEN
VCC
VO
Fig.4
Input sequence 1
Co=1µF
VEN
VCC
VO
Fig.5
OFF sequence 1
Co=1µF
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
5/18
TSZ02201-0R6R0A600330-1-2
28.Dec.2012 Rev.002
Free Datasheet http://www.datasheet4u.com/
5 Page 
BDxxHC0WEFJ
Datasheet
●Power Dissipation
◎HTSOP-J8
4.0
⑤3.76W
3.0
④2.11W
2.0
③1.10W
1.0 ②0.82W
①0.50W
0
0 25 50 75 100 125
Ambient 周Te囲m温p度e:rTaatu[℃re] :Ta [℃]
Measurement condition: mounted on a ROHM board,
and IC
Substrate size: 70mm × 70mm × 1.6mm
(Substrate with thermal via)
・Solder the thermal pad to Ground
① IC only
θj-a=249.5℃/W
② 1-layer（copper foil are :0mm×0mm）
θj-a=153.2℃/W
③ 2-layer（copper foil are :15mm×15mm）
θj-a=113.6℃/W
④ 2-layer（copper foil are :70mm×70mm）
θj-a=59.2℃/W
⑤ 4-layer（copper foil are :70mm×70mm）
θj-a=33.3℃/W
150
Thermal design should ensure operation within the following conditions. Note that the temperatures listed are the allowed
temperature limits and thermal design should allow sufficient margin beyond these limits.
1. Ambient temperature Ta can be no higher than 85℃.
2. Chip junction temperature (Tj) can be no higher than 150℃.
Chip junction temperature can be determined as follows:
Calculation based on ambient temperature (Ta)
Tj=Ta+θj-a×P
＜Reference values＞
θj-a: HTSOP-J8 153.2℃/W 1-layer substrate (copper foil density 0mm×0mm)
113.6℃/W 2-layer substrate (copper foil density 15mm×15mm)
59.2℃/W 2-layer substrate (copper foil density 70mm×70mm)
33.3℃/W 4-layer substrate (copper foil density 70mm×70mm)
Substrate size: 70mm×70mm×1.6mm (substrate with thermal via)
Most of the heat loss that occurs in the BDxxHC0WEFJ series is generated from the output Pch FET. Power loss is
determined by the total VCC-VO voltage and output current. Be sure to confirm the system input and output voltage as well as
the output current conditions in relation to the heat dissipation characteristics of the VCC and VO in the design. Bearing in
mind that heat dissipation may vary substantially depending on the substrate employed (due to the power package
incorporated in the BDxxHC0WEFJ series) make certain to factor conditions such as substrate size into the thermal design.
Power consumption [W] = Input voltage (VCC) - Output voltage (VO) ×IO(Ave)
Example) Where VCC=5.0V, VO=3.3V, IO(Ave) = 0.1A,
Power consumption [W] = 5.0 V - 3.3V ×0.1A
=0.17[W]
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
11/18
TSZ02201-0R6R0A600330-1-2
28.Dec.2012 Rev.002
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
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