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PDF 74F676SC Data sheet ( Hoja de datos )

Número de pieza 74F676SC
Descripción 16-Bit Serial/Parallel-In / Serial-Out Shift Register
Fabricantes National 
Logotipo National Logotipo



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No Preview Available ! 74F676SC Hoja de datos, Descripción, Manual

December 1994
54F 74F676
16-Bit Serial Parallel-In Serial-Out Shift Register
General Description
The ’F676 contains 16 flip-flops with provision for synchro-
nous parallel or serial entry and serial output When the
Mode (M) input is HIGH information present on the parallel
data (P0 – P15) inputs is entered on the falling edge of the
Clock Pulse (CP) input signal When M is LOW data is shift-
ed out of the most significant bit position while information
present on the Serial (SI) input shifts into the least signifi-
cant bit position A HIGH signal on the Chip Select (CS)
input prevents both parallel and serial operations
Features
Y 16-bit parallel-to-serial conversion
Y 16-bit serial-in serial-out
Y Chip select control
Y Slim 24 lead 300 mil package
Commercial
74F676PC
74F676SPC
74F676SC (Note 1)
Military
54F676DM (Note 2)
54F676SDM (Note 2)
54F676FM (Note 2)
54F676LM (Note 2)
Package
Number
N24A
N24C
J24A
J24F
M24B
W24C
E28A
Package Description
24-Lead (0 600 Wide) Molded Dual-In-Line
24-Lead (0 300 Wide) Molded Dual-In-Line
24-Lead (0 600 Wide) Ceramic Dual-In-Line
24-Lead (0 300 Wide) Ceramic Dual-In-Line
24-Lead (0 300 Wide) Molded Small Outline JEDEC
24-Lead Cerpack
24-Lead Ceramic Leadless Chip Carrier Type C
Note 1 Devices also available in 13 reel Use suffix e SCX
Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB
Connection Diagrams
Pin Assignment
for DIP SOIC and Flatpak
Pin Assignment
for LCC
TL F 9588 – 2
TRI-STATE is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation TL F 9588
TL F 9588 – 3
RRD-B30M105 Printed in U S A

1 page




74F676SC pdf
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F 676 S C X
Temperature Range Family
74FeCommercial
54FeMilitary
Device Type
Package Code
P e Plastic DIP
SP e Slim Plastic DIP
D e Ceramic DIP
SD e Slim Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline SOIC JEDEC
Special Variations
QB e Military grade device with
environmental and burn-in
processing
Temperature Range
CeCommercial (0 C to a70 C)
MeMilitary (b55 C to a125 C)
5

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