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Número de pieza | NHPM260T3G | |
Descripción | Surface Mount Ultra Fast Power Rectifier | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
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No Preview Available ! NHPM260T3G,
NRVHPM260T3G
Surface Mount
Ultra Fast Power Rectifier
POWERMITE®
Power Surface Mount Package
The ultrafast Powermite® provides soft recovery fast switching
performance in a compact thermally efficient package. The advanced
packaging techniques provide for a very efficient micro−miniature
space−saving surface mount rectifier. With its unique heatsink design,
the Powermite® offers thermal performance similar to the SMA while
being 50% smaller in footprint area.
Features
• Fast Soft Switching for Reduced EMI and Higher Efficiency
• Low Profile − Maximum Height of 1.1 mm
• Small Footprint − Footprint Area of 8.45 mm2
• Supplied in 12 mm Tape and Reel
• Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
• These Devices are Pb−Free, Halogen Free and are RoHS Compliant
Mechanical Characteristics:
• Powermite® is JEDEC Registered as D0−216AA
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 16.3 mg (Approximately)
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
• MSL 1
Applications
• Automotive HID Lighting
• Diesel Piezo Injection
• Power Factor Correction in Mini Adapters
• Freewheeling Diode Where Space is at a Premium
www.onsemi.com
ULTRA FAST
RECTIFIER
2.0 AMPERES, 600 VOLTS
CATHODE
ANODE
POWERMITE
CASE 457
MARKING DIAGRAM
M
1 P26G
2
M = Date Code
P26 = Device Code
G = Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping†
NHPM260T3G
Powermite 12000/Tape & Reel
(Pb−Free)
NRVHPM260T3G Powermite 12000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. 2
1
Publication Order Number:
NHPM260/D
1 page NHPM260T3G, NRVHPM260T3G
PACKAGE DIMENSIONS
POWERMITE
CASE 457−04
ISSUE F
−A−
S
C
J
F
0.08 (0.003) M T B S C S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 (0.006) PER SIDE.
−B−
K
R
J
L
PIN 1
PIN 2
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 1.75 2.05 0.069 0.081
B 1.75 2.18 0.069 0.086
C 0.85 1.15 0.033 0.045
D 0.40 0.69 0.016 0.027
F 0.70 1.00 0.028 0.039
H -0.05 +0.10 -0.002 +0.004
J 0.10 0.25 0.004 0.010
K 3.60 3.90 0.142 0.154
L 0.50 0.80 0.020 0.031
R 1.20 1.50 0.047 0.059
S 0.50 REF
0.019 REF
H
−T−
D
0.08 (0.003) M T B S C S
SOLDERING FOOTPRINT*
2.67
0.105
0.635
0.025
0.762
0.030
2.54
0.100
1.27
0.050
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
www.onsemi.com
5
NHPM260/D
5 Page |
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PDF Descargar | [ Datasheet NHPM260T3G.PDF ] |
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