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centralsemi |
Product Brief
CPD31X
CPD34X
10A, 60V
Schottky Rectifier Die
Die Size
Die Thickness
Die Passivation
Anode Bonding Pad Area
Top Side Metalization (CPD31X)
Top Side Metalization (CPD34X)
Back Side Metalization
Scribe Alley Width
Wafer Diameter
Gross Die Per Wafer
CPD31X
CPD34X
85 MILS x 85 MILS
5.9 MILS ±0.8 MILS
SiN
78 MILS x 78 MILS
Al/Ni/Au - 30,000Å/4,000Å/1,500Å
Al - 30,000Å
Ti/Ni/Au - 1,600Å/5,550Å/1,500Å
3.15 MILS
5 INCHES
2,260
Features:
• Low forward voltage at 10 Amps forward current
• Low reverse leakage current
• Low profile geometry
• Metalization suitable for standard die attached technologies
• Top metalization optimized for solder process (CPD31X)
• Top metalization optimized for wire bonding (CPD34X)
Applications:
• Optimized for use as a by-pass rectifier in low profile
solar (PV) panels
• Reverse polarity protection
• OR-ing diode
Benefits:
• Energy efficiency
• High temperature characterization
• Space savings
Literature
Typical Electrical Characteristics
Samples
To order samples contact:
Central’s Sales department
631-435-1110
To order the latest Chip databook, visit:
web.centralsemi.com/search/sample.php
VRRM
(V)
MAX
60
Maximum Ratings (TA = 25˚C)
VR IO IFSM
TJ, Tstg
BVR
Electrical Characteristics (TA = 25˚C unless otherwise noted)
VF
@ IF
IR
@ VR
(V) (A) (A)
(˚C)
(V) (V) (V) (A)
(V)
MAX
MAX
MAX
MAX
MIN TYP MAX
TYP
MAX
MAX
60
10
250 -65 to +150
60
0.49
0.59
–
0.67
5.0
75μA
500μA
60
10
–
*50mA
*60
*TA=100˚C
145 Adams Avenue • Hauppauge • New York • 11788 • USA • www.centralsemi.com
http://www.Datasheet4U.com
CPD31X
CPD34X
Wafer Form
• 100% tested with rejects inked
• Use - WN suffix when ordering
60V, 10A
Schottky Rectifier Chip
Packing Information
ESD Protective Lid
Sawn Wafer
• Available on metal frame or plastic ring
• 100% tested with rejects inked.
• Mounted on adhesive membrane on a metal frame or
plastic ring.
• Use - WS suffix when ordering for metal frame
• Use - WR suffix when ordering for plastic ring.
Anti-Static Foam
Anti-Static Foam
Anti-Static Foam
Anti-Static
Polyethylene Protective Layer
Wafer
Anti-Static
Polyethylene Protective Layer
Anti-Static Foam
Sawn Wafer
Adhesive Membrane
Metal Frame
ESD Protective Container
Sawn Wafer
Adhesive Membrane
Plastic Ring
Chip Form
• Waffle Packed.
• Use: -CT, -CM, -CTO suffix when ordering.
• -CT (100% tested with rejects removed).
• -CM (100% tested and 100% visually inspected per
MIL-STD -750, [method 2072 transistors]
[method 2073 diodes] with rejects removed).
• -CTO (100% tested with rejects removed,
die orientation as specified by customer.)
ESD Protective Cover
Anti-Static Polyethylene
Protective Layer
ESD Protective Chip Tray
Innovative Discrete
Semiconductors
For further information contact:
Sales at Central Semiconductor Corp.
(631) 435-1110 or visit our website at:
www.centralsemi.com
145 Adams Avenue • Hauppauge • New York • 11788 • USA • Tel:(631) 435-1110 • Fax:(631) 435-1824
PB CPD31X
http://www.Datasheet4U.com
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