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PDF MB05S Data sheet ( Hoja de datos )
| Número de pieza | MB05S | |
| Descripción | 0.8 Amp Surface Mount Single Phase Bridge Rectifiers | |
| Fabricantes | Thinki Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MB05S (archivo pdf) en la parte inferior de esta página. Total 2 Páginas | ||
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MB05S thru MB13S
®
Pb Free Plating Product
MB05S thru MB13S
Pb
0.8 Amp Surface Mount Single Phase Bridge Rectifiers
Features
Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
Glass passivated chip junctions
High surge overload rating: 35A peak
Saves space on printed circuit boards
High temperature soldering guaranteed: 260oC/10 seconds.
Maximum Ratings
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Mounting Position: Any
Weight: 0.078 oz., 0.22 g
MDS
.275(7)MAX
.165(4.2)
.150(3.8)
Unit: inch(mm)
.106(2.7)
.090(2.3)
.067(1.7)
.057(1.3)
C .02(.5)
.051(1.3)
.035(0.9)
.008(.20)
.043(1.1)
.027(0.7)
Maximum Ratings and Electrical Characteristics
(TA=25oC unless otherwise noted)
Parameter
Symbols MB05S MB2S MB4S MB6S MB8S MB10S MB13S Units
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward output rectified current
(see Fig.1)
on glass-epoxy P.C.B.
on aluminum substrate
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC Method)
Rating for fusing (t < 8.3ms)
Maximum instantaneous forward voltage drop per leg at 0.4A
Maximum DC reverse current at
rated DC blocking voltage per leg
TA = 25oC
TA = 125oC
Typical thermal resistance per leg
Typical junction capacitance per leg at 4.0V, 1.0MHz
Operating junction and storage temperature range
VRRM
VRMS
VDC
IF(AV)
IFSM
I2t
VF
IR
RθJA
RθJA
RθJL
CJ
TJ, TSTG
50
35
50
200 400 600 800 1000 1300 Volts
140 280 420 560 700 910 Volts
200 400 600 800 1000 1300 Volts
0.5 (1)
0.8 (2)
35.0
5.0
1.0
5.0
100
85 (1)
70 (2)
20 (1)
13
-55 to +150
Amp
Amps
A2sec
Volt
uA
oC/W
pF
oC
Notes: 1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads
2. On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad
© 2006 Thinki Semiconductor Co.,Ltd.
Page 1/2
http://www.thinkisemi.com/
Free Datasheet http://www.datasheet4u.com/
1 page | ||
| Páginas | Total 2 Páginas | |
| PDF Descargar | [ Datasheet MB05S.PDF ] | |
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