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CYStech Electronics |
CYStech Electronics Corp.
Spec. No. : C877FP
Issued Date : 2015.06.29
Revised Date :
Page No. : 1/8
P-Channel Enhancement Mode Power MOSFET
MTB15P04FP BVDSS
ID
RDS(ON)@VGS=-10V, ID=-25A
RDS(ON)@VGS=-4.5V, ID=-15A
-40V
-56A
9.7mΩ(typ)
12.7mΩ(typ)
Features
• Single Drive Requirement
• Low On-resistance
• Fast switching Characteristic
• Pb-free lead plating package
Symbol
MTB15P04FP
Outline
TO-220FP
G:Gate
D:Drain
S:Source
GDS
Ordering Information
Device
MTB15P04FP-0-UB-S
Package
TO-220FP
(Pb-free lead plating package)
Shipping
50 pcs/tube, 20 tubes/box, 4 boxes / carton
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, UB : 50 pcs / tube, 20 tubes/box
Product rank, zero for no rank products
Product name
MTB15P04FP
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C877FP
Issued Date : 2015.06.29
Revised Date :
Page No. : 2/8
Absolute Maximum Ratings (Ta=25°C)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current @VGS=-10V, TC=25°C (Package limited)
Continuous Drain Current @VGS=-10V, TC=25°C (Silicon limited)
Continuous Drain Current @VGS=-10V, TC=100°C
Continuous Drain Current @VGS=-10V, TA=25°C
(Note 2)
Continuous Drain Current @VGS=-10V, TA=70°C
(Note 2)
Pulsed Drain Current
(Note 4)
TC=25℃
(Note 1)
Power Dissipation
TC=100℃
TA=25℃
(Note 1)
(Note 2)
TA=70℃
(Note 2)
Single Pulse Avalanche Energy @L=1mH, IAS=-20A
Single Pulse Avalanche Current
Operating Junction and Storage Temperature
(Note 3)
(Note 3)
Symbol
VDS
VGS
ID
IDSM
IDM
PD
PDSM
EAS
IAS
Tj, Tstg
Limits
-40
±20
-56
-62.5
-39.5
-10
-8
-250
78
31.2
2
1.3
200
-20
-55~+150
Unit
V
A
W
mJ
A
°C
Thermal Data
Parameter
Thermal Resistance, Junction-to-case, max
Thermal Resistance, Junction-to-ambient, max, t≤10s (Note 1)
Thermal Resistance, Junction-to-ambient, max
(Note 1)
Symbol
Rth,j-c
Rth,j-a
Value
1.6
15
62.5
Unit
°C/W
Note : 1.The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful
in setting the upper dissipation limit for cases where additional heatsinking is used.
2. The value of RθJA is measured with the device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment
with TA=25°C. The power dissipation PDSM is based on RθJA and the maximum allowed junction
temperature of 150°C. The value in any given application depends on the user’s specific board design.
3. Pulse width limited by junction temperature TJ(MAX)=150°C.
4. Pulse width ≤300μs pulses and duty cycle ≤0.5%.
5. The RθJA is the sum of thermal resistance from junction to case RθJC and case to ambient.
MTB15P04FP
CYStek Product Specification
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