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Toshiba Semiconductor |
MOSFETs Silicon P-Channel MOS (U-MOS)
TJ150F06M3L
1. Applications
• Relay Drivers
• Motor Drivers
2. Features
(1) Low drain-source on-resistance: RDS(ON) = 4.3 mΩ (typ.) (VGS = -10 V)
(2) Low leakage current: IDSS = -10 µA (max) (VDS = -60 V)
(3) Enhancement mode: Vth = -2.0 to -3.0 V (VDS = -10 V, ID = -1 mA)
3. Packaging and Internal Circuit
TJ150F06M3L
1: Gate
2: Drain (Heatsink)
3: Source
TO-220SM(W)
4. Absolute Maximum Ratings (Note) (Ta = 25 unless otherwise specified)
Characteristics
Symbol
Rating
Unit
Drain-source voltage
VDSS -60 V
Gate-source voltage
VGSS
-20/+10
Drain current (DC)
(Note 1)
ID
-150
A
Drain current (pulsed)
(Note 1)
IDP
-450
Power dissipation
(Tc = 25)
PD 300 W
Single-pulse avalanche energy
(Note 2)
EAS
430 mJ
Avalanche current
IAR
-150
A
Channel temperature
(Note 3)
Tch
175
Storage temperature
(Note 3)
Tstg
-55 to 175
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
1 2012-01-13
Rev.1.0
5. Thermal Characteristics
TJ150F06M3L
Characteristics
Symbol Max Unit
Channel-to-case thermal resistance
Rth(ch-c)
0.5 /W
Note 1: Ensure that the channel temperature does not exceed 175.
Note 2: VDD = -25 V, Tch = 25 (initial), L = 26 µH, RG = 25 Ω, IAR = -150 A
Note 3: The definitions of the absolute maximum channel and storage temperatures are based on AEC-Q101.
Note: This transistor is sensitive to electrostatic discharge and should be handled with care.
2 2012-01-13
Rev.1.0
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