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Stanley |
Product Guide
F_1111C Series Ultra Compact AlInGaP SMT LED
s Features
• Meets industry standards for 1608 (0603) footprint
• Provides bright, wide and uniform spatial distribution
• Excellent for cellular telephone key pads,
• LCD backlighting and pager display applications
s Applications
• Mobile devices (cellular telephones, PDAs, pagers)
• Industrial / Medical instrumentation
s Outline Dimensions
www.DataSheet4U.com
Unit: mm
Tolerances + 0.1
Epoxy PCB
PCB Warpage direction
s Electro-Optical Characteristics
Part No.
FR1111C
FA1111C
FY1111C
Material Emitted Lens Luminous
Color Color Intensity IV
AlInGaP
AlInGaP
AlInGaP
Red
Orange
Yellow
MIN. TYP.
IF
25 50 20
Milky
White
25
65
20
25 65 20
Peak
λp
TYP.
635
Wavelength
Spectral Line
Dominant Half Width
λd ∆λ
TYP.
TYP.
IF
626 15 20
609 605 15 20
592 590 15 20
(Ta=25°C)
Forward
Voltage VF
TYP. MAX.
1.9 2.4
1.9 2.4
1.9 2.4
IF
20
20
20
Reverse Viewing
Current IR Angle
(2 θ 1/2)
MAX. VR
100 5
100 5 140°
100 5
Units
mcd mA
nm
mA V mA µA V Deg.
s Absolute Maximum Ratings
Item
Symbol
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Pd
IF
IFM
VR
Topr
Tstg
∆IF
Red
FR
81
30
100
5
Orange
FA
81
30
100
5
-40 to +85
-40 to +100
0.43 (DC) 1.0 (Pulse)
Yellow
FY
81
30
100
5
(Ta=25°C)
Units
mW
mA
mA
V
°C
°C
mA/°C
* Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.
s Operation Current Derating Chart (DC)
FR, FA, FY
s Taping Specifications
φ
1.5
+0.1
0
4+0.1
(1)
(φ 0.5)
Center Hole
2+0.05
4+0.1
(0.2)
Center Hole
Direction to pull
(0.9)
Quantity on tape:
Q4u0a0n0titpyieocnestape:
4p0e0r0repeielces
per reel
φ 21+0.8
2+0.5
φ 13+0.2
s Spatial Distribution
11.4+1
9+0.3
φ 180+30
s Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120°C ~ 150°C max. (resin surface temp.)
60-120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
°C
Operation Heating
240
150
Temperature
Pre-heating rise: 5°C/sec.
120
Cooling:
—5°C/sec.
0
60 to 120 sec.
5 sec. max
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGF_1111C-0301
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com
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