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PDF VLMB31K2L2-GS08 Data sheet ( Hoja de datos )

Número de pieza VLMB31K2L2-GS08
Descripción Standard SMD LED PLCC-2
Fabricantes Vishay 
Logotipo Vishay Logotipo



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No Preview Available ! VLMB31K2L2-GS08 Hoja de datos, Descripción, Manual

www.vishay.com
VLMB31..
Vishay Semiconductors
Standard SMD LED PLCC-2
19225
DESCRIPTION
The package of the VLMB31..-series is the PLCC-2. It
consists of a lead frame which is embedded in a white
thermoplast. The reflector inside this package is filled up
with clear epoxy.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Product series: standard
• Angle of half intensity: ± 60°
FEATURES
• SMD LED with exceptional brightness
• Luminous intensity categorized
• Compatible with automatic placement equipment
• EIA and ICE standard package
• Compatible with IR reflow, vapor phase
and wave solder processes according to
CECC 00802 and J-STD-020
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light
pipes and backlighting
• Low power consumption
• Luminous intensity ratio in one packaging
IVmax./IVmin. 1.6
• Preconditioning according to JEDEC® level 2 a
unit
• ESD withstand voltage: up to 2 kV according to
JESD22-A114-B
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Automotive: backlighting in dashboards and switches
• Telecommunication: indicator and backlighting in
telephone and fax
• Indicator and backlight for audio and video equipment
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches, and symbols
• General use
PARTS TABLE
PART
VLMB31J2L2-GS08
VLMB31J2L2-GS18
VLMB31K2L2-GS08
VLMB31K2L2-GS18
VLMB31J2K2-GS08
VLMB31J2K2-GS18
COLOR
Blue
Blue
Blue
Blue
Blue
Blue
LUMINOUS
INTENSITY
(mcd)
at IF
(mA)
MIN. TYP. MAX.
5.6 10 18 10
5.6 10 18 10
9 10.5 18 10
9 10.5 18 10
5.6 10 11.2 10
5.6 10 11.2 10
WAVELENGTH
(nm)
at IF
(mA)
MIN. TYP. MAX.
458 466 472 10
458 466 472 10
458 466 472 10
458 466 472 10
458 466 472 10
458 466 472 10
FORWARD
VOLTAGE
(V)
MIN. TYP. MAX.
at IF
(mA)
TECHNOLOGY
- 3.9 4.5 20 GaN on SiC
- 3.9 4.5 20 GaN on SiC
- 3.9 4.5 20 GaN on SiC
- 3.9 4.5 20 GaN on SiC
- 3.9 4.5 20 GaN on SiC
- 3.9 4.5 20 GaN on SiC
Rev. 1.7, 03-Aug-15
1 Document Number: 81621
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

1 page




VLMB31K2L2-GS08 pdf
www.vishay.com
VLMB31..
Vishay Semiconductors
METHOD OF TAPING / POLARITY AND TAPE AND REEL
SMD LED (VLM.3-SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN IEC 40
(CO) 564) for automatic component insertion. The blister
tape is a plastic strip with impressed component cavities,
covered by a top tape.
Adhesive tape
Blister tape
Component cavity
94 8670
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS18
(= 8000 PCS) PREFFERED
120°
10.4
8.4
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
4.5
3.5
2.5
1.5
13.00
12.75
321 14.4 max.
329
Fig. 9 - Reel Dimensions - GS18
62.5
60.0
18857
TAPING OF VLM.3..
3.5
3.1
2.2
2.0
5.75
5.25
3.6 8.3
3.4 7.7
4.0
3.6
1.85
1.65
1.6 4.1
1.4 3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Fig. 7 - Tape Dimensions in mm for PLCC-2
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08
(= 1500 PCS)
120°
10.0
9.0
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
4.5
3.5
2.5
1.5
13.00
12.75
63.5
60.5
180 14.4 max.
178
94 8665
Fig. 8 - Reel Dimensions - GS08
SOLDERING PROFILE
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC level 2a
300
250
255 °C
240 °C
217 °C
200
150
100
max. 120 s
max. 260 °C
245 °C
max. 30 s
max. 100 s
50 max. ramp up 3 °C/s
max. ramp down 6 °C/s
0
0
19885
50
100 150 200 250 300
Time (s)
max. 2 cycles allowed
Fig. 10 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020)
TTW Soldering (acc. to CECC00802)
300
5s
lead temperature
250 235 °C
to 260 °C
first wave
200
second
wave full line: typical
dotted line: process limits
ca. 200 K/s
150 100 °C
to 130 °C
100
ca. 2 K/s
2 K/s
ca. 5 K/s
50
forced cooling
0
0
948626-1
50 100 150 200 250
Time (s)
Fig. 11 - Double Wave Soldering of Opto Devices (all Packages)
Rev. 1.7, 03-Aug-15
5 Document Number: 81621
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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