파트넘버.co.kr B089AW01_V3 데이터시트 PDF


B089AW01_V3 반도체 회로 부품 판매점

LCD Module



AUO 로고
AUO
B089AW01_V3 데이터시트, 핀배열, 회로
www.DataSheet4U.net
Product Specification
AU OPTRONICS CORPORATION
( ) Preliminary Specifications
( V ) Final Specifications
Module
Model Name
Note ( )
” WSVGA Color TFT-LCD with LED Backlight design
B089AW01 V3
LED Backlight with driving circuit design
Customer
Date
Approved by
Date
Checked &
Approved by
Date
Howard Lee
Prepared by
11/05/2008
Wisdom Che
11/05/2008
Note: This Specification is subject to change without
notice.
NBBU Marketing Division /
AU Optronics corporation
document version 1.0
Contents
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B089AW01_V3 데이터시트, 핀배열, 회로
www.DataSheet4U.net
Product Specification
AU OPTRONICS CORPORATION
1. Handling Precautions........................................................................................................ 4
2. General Description .......................................................................................................... 5
2.1 General Specification...................................................................................................................................... 5
2.2 Optical Characteristics ................................................................................................................................... 6
3. Functional Block Diagram ............................................................................................... 11
4. Absolute Maximum Ratings....................................................................................................................................11
5. Electrical characteristics ................................................................................................. 13
5.1 TFT LCD Module............................................................................................................................................ 13
5.2 Backlight Unit ................................................................................................................................................ 15
6. Signal Characteristic ....................................................................................................... 16
6.1 Pixel Format Image........................................................................................................................................ 16
6.2 The input data format.................................................................................................................................... 17
6.3 Signal Description/Pin Assignment ............................................................................................................. 18
6.4 Interface Timing............................................................................................................................................. 21
6.5 Power Sequence............................................................................................................................................ 23
6.5.1 Panel Power Sequence .............................................................................................................................. 23
7. Connector Description .................................................................................................... 24
7.1 TFT LCD Module............................................................................................................................................ 24
8. 8. LED Driving Specification ............................................................................................ 25
8.1 Connector Description.................................................................................................................................. 25
8.2 Pin Assignment.............................................................................................................................................. 25
9. Vibration and Shock Test ................................................................................................ 26
9.1 Vibration Test ................................................................................................................................................. 26
9.2 Shock Test Spec: ........................................................................................................................................... 26
11. Mechanical Characteristics............................................................................................ 28
11.1 LCM Outline Dimension .............................................................................................................................. 28
11.2 Screw Hole Depth and Center Position ..................................................................................................... 29
12. Shipping and Package................................................................................................... 30
12.1 Shipping Label Format................................................................................................................................ 30
12.2 Carton package............................................................................................................................................ 31
12.3 Shipping package of palletizing sequence ............................................................................................... 31
13. Appendix: EDID description .......................................................................................... 32
document version 1.0
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