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PDF 74F573SMX Data sheet ( Hoja de datos )

Número de pieza 74F573SMX
Descripción Octal D-Type Latch with TRI-STATE Outputs
Fabricantes National 
Logotipo National Logotipo



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No Preview Available ! 74F573SMX Hoja de datos, Descripción, Manual

August 1995
54F 74F573
Octal D-Type Latch with TRI-STATE Outputs
General Description
The ’F573 is a high speed octal latch with buffered common
Latch Enable (LE) and buffered common Output Enable
(OE) inputs
This device is functionally identical to the ’F373 but has
different pinouts
Features
Y Inputs and outputs on opposite sides of package
allowing easy interface with microprocessors
Y Useful as input or output port for microprocessors
Y Functionally identical to ’F373
Y TRI-STATE outputs for bus interfacing
Y Guaranteed 4000V minimum ESD protection
Commercial
74F573PC
74F573SC (Note 1)
74F573SJ (Note 1)
Military
54F573DM (Note 2)
54F573FM (Note 2)
54F573LM (Note 2)
Package
Number
N20A
J20A
M20B
M20D
W20A
E20A
Package Description
20-Lead (0 300 Wide) Molded Dual-In-Line
20-Lead Ceramic Dual-In-Line
20-Lead (0 300 Wide) Molded Small Outline JEDEC
20-Lead (0 300 Wide) Molded Small Outline EIAJ
20-Lead Cerpak
20-Lead Ceramic Leadless Chip Carrier Type C
Note 1 Devices also available in 13 reel Use suffix e SCX and SJX
Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB
Logic Symbols
Connection Diagrams
Pin Assignment for
DIP SOIC and Flatpak
Pin Assignment
for LCC
TL F 9566–1
IEEE IEC
TL F 9566 – 2
TL F 9566 – 3
TL F 9566–4
TRI-STATE is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation TL F 9566
RRD-B30M115 Printed in U S A

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74F573SMX pdf
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F 573 S C X
Temperature Range Family
74FeCommercial
54FeMilitary
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
Special Variations
QB e Military grade device with
environmental and burn-in
processing
X e Devices shipped in 13 reels
Temperature Range
CeCommercial (0 C to a70 C)
MeMilitary (b55 C to a125 C)
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5

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