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Fairchild Semiconductor |
February 1984
Revised January 2005
MM74HCT05
Hex Inverter (Open Drain)
General Description
The MM74HCT05 is a logic function fabricated by using
advanced silicon-gate CMOS technology, which provides
the inherent benefits of CMOS—low quiescent power and
wide power supply range. The device is also input and out-
put characteristic and pinout compatible with standard
DM74LS logic families. The MM74HCT05 open drain Hex
Inverter requires the addition of an external resistor to per-
form a wire-NOR function.
All inputs are protected from static discharge damage by
internal diodes to VCC and ground.
MM74HCT devices are intended to interface between TTL
and NMOS components and standard CMOS devices.
These parts are also plug-in replacements for LS-TTL
devices and can be used to reduce power consumption in
existing designs.
Features
s Open drain for wire-NOR function
s LS-TTL pinout and threshold compatible
s Fanout of 10 LS-TTL loads
s Typical propagation delays:
tPZL (with 1 kΩ resistor) 10 ns
tPLZ (with 1 kΩ resistor) 8 ns
Ordering Code:
Order Number Package Number
Package Description
MM74HCT05M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MM74HCT05SJ
M14D
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HCT05MTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HCT05N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Connection Diagram
Logic Diagram
Top View
Typical Application
© 2005 Fairchild Semiconductor Corporation DS005358
www.fairchildsemi.com
Free Datasheet http://www.datasheet4u.net/
Absolute Maximum Ratings(Note 1)
(Note 2)
Supply Voltage (VCC)
DC Input Voltage (VIN)
DC Output Voltage (VOUT)
Clamp Diode Current (IIK, IOK)
DC Output Current, per pin (IOUT)
DC VCC or GND Current, per pin (ICC)
Storage Temperature Range (TSTG)
Power Dissipation (PD)
(Note 3)
S.O. Package only
Lead Temperature (TL)
(Soldering 10 seconds)
−0.5 to +7.0V
−1.5 to VCC +1.5V
−0.5 to +7.0V
± 20 mA
+ 25 mA
± 50 mA
−65°C to +150°C
600 mW
500 mW
260°C
Recommended Operating
Conditions
Min Max Units
Supply Voltage (VCC)
DC Input Voltage (VIN)
Output Voltage (VOUT)
Operating Temperature Range (TA)
Input Rise or Fall Times
4.5
0
0
−40
5.5
VCC
5.5
+85
V
V
V
°C
(tr, tf)
500 ns
Note 1: Absolute Maximum Ratings are those values beyond which dam-
age to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating — plastic “N” package: −
12 mW/°C from 65°C to 85°C.
DC Electrical Characteristics
(VCC = 5V ± 10%,unless otherwise specified)
Symbol
Parameter
Conditions
VIH Minimum HIGH Level Input Voltage
VIL Maximum LOW Level Input Voltage
VOL Maximum LOW
VIN = VIH
Level Voltage
|IOUT| = 20 µA
|IOUT| = 4.0 mA, VCC = 4.5V
|IOUT| = 4.8 mA, VCC = 5.5V
IIN Maximum Input Current
VIN = VCC or GND,
VIH or VIL
ILKG Maximum HIGH Level
VIN = VIH or VIL,
Output Leakage Current
VOUT = VCC
ICC Maximum Quiescent
VIN = VCC or GND
Supply Current
IOUT = 0µA
VIN = 2.4V or 0.5V (Note 4)
IOHZ
Off State Current
VCC = 4.5 - 5.5, VO = 5.5
Note 4: This is measured per input with all other inputs held at VCC or ground.
TA = 25°C
TA = −40 to 85°C
Typ Guaranteed Limits
2.0 2.0
0.8 0.8
Units
V
V
0 0.1
0.2 0.26
0.2 0.26
± 0.1
0.1
0.33
0.33
± 1.0
V
µA
0.5 5.0 µA
2.0 20 µA
0.3 0.4 mA
10 µA
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Free Datasheet http://www.datasheet4u.net/
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