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PDF 74LVC1GU04GW Data sheet ( Hoja de datos )
| Número de pieza | 74LVC1GU04GW | |
| Descripción | Inverter | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
74LVC1GU04
Inverter
Product specification
Supersedes data of 2000 Dec 12
File under Integrated Circuits, IC24
2001 Apr 06
1 page  
Philips Semiconductors
Inverter
Product specification
74LVC1GU04
DC CHARACTERISTICS
At recommended operating conditions; voltage are referenced to GND (ground = 0 V).
SYMBOL PARAMETER
TEST CONDITIONS
OTHER
VCC (V)
VIH HIGH-level input
voltage
1.65 to 5.5
VIL LOW-level input
voltage
1.65 to 5.5
VOL LOW-level VI = VIH or VIL; IO = 100 µA 1.65 to 5.5
output voltage VI = VIH or VIL; IO = 4 mA
1.65
VI = VIH or VIL; IO = 8 mA 2.3
VI = VIH or VIL; IO = 12 mA 2.7
VI = VIH or VIL; IO = 24 mA 3.0
VI = VIH or VIL; IO = 32 mA 4.5
VOH HIGH-level VI = VIH or VIL; IO = −100 µA 1.65 to 5.5
output voltage VI = VIH or VIL; IO = −4 mA 1.65
VI = VIH or VIL; IO = −8 mA 2.3
VI = VIH or VIL; IO = −12 mA 2.7
VI = VIH or VIL; IO = −24 mA 3.0
VI = VIH or VIL; IO = −32 mA 4.5
ILI input leakage VI = 5.5 V or GND
current
3.6
ICC
quiescent supply VI = VCC or GND; IO = 0
5.5
current
Tamb (°C)
−40 to +85
MIN. TYP.(1) MAX.
0.75 × VCC −
−
− − 0.25 × VCC
−
−
−
−
−
−
VCC − 0.1
1.2
1.9
2.2
2.3
3.8
−
−
−
−
−
−
−
−
−
−
−
−
−
±0.1
0.1
0.45
0.3
0.4
0.55
0.55
−
−
−
−
−
−
±5
− 0.1 10
UNIT
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA
µA
Note
1. All typical values are measured at VCC = 3.3 V and Tamb = 25 °C.
2001 Apr 06
5
5 Page 
Philips Semiconductors
Inverter
Product specification
74LVC1GU04
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
SOLDERING METHOD
WAVE
REFLOW(1)
not suitable
suitable
not suitable(2)
suitable
suitable
suitable
not recommended(3)(4) suitable
not recommended(5) suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Apr 06
11
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| PDF Descargar | [ Datasheet 74LVC1GU04GW.PDF ] | |
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