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PDF NIN Data sheet ( Hoja de datos )
| Número de pieza | NIN | |
| Descripción | Molded Chip Wirewound Inductors | |
| Fabricantes | NIC-Components | |
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Hay una vista previa y un enlace de descarga de NIN (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
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Molded Chip Wirewound Inductors
FEATURES
RoHS
• EIA SIZES A (1210), B (1812) AND C (1008)
• EXCELLENT HIGH Q AND HIGH SRF CHARACTERISTICS
Compliant
• BOTH FLOW AND REFLOW SOLDERING APPLICABLE
includes all homogeneous materials
• HIGH INDUCTANCE AVAILABLE IN SMALL SIZE
*See Part Number System for Details
• EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE
AVAILABLE TYPE AND RANGE
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SPECIFICATIONS
Specifications
Inductance Range
Inductance Tolerance
Operating Temperature Range
www.DataSheet4U.com
Insulation Resistance
Withstanding Voltage
Q-Factor, Self Resonant Frequency
DC Resistance, Rated DC Current
and Inductance Tolerance
Case Size
1008
1210
1812
10nH ~ 100 µH 47nH ~ 330µH 0.10µH ~ 1000 µH
±20% (M), ±10% (K), ±5% (J)
±10% (K), ±5% (J)
-25°C ~ +85°C (at 100% of rated voltage)
1,000 MegOhm Min. (@ 100Vdc, Termination to Case)
250 Vdc for 1 minute (Termination to Case)
See Individual Product Listings
NIN Series
ENVIRONMENTAL CHARACTERISTICS
Test Specification
Solderability
90% Min. Coverage
Humidity
Soldering Effect
(1) No Evidence of Damage
(2) Inductance Shall Be
Within +5% of initial
Low Frequency Vibration Value
Thermal Shock
(3) Q Factor Shall Be
Within +10 of initial
Low Temperature Storage Value
(1) No Evidence of Damage
High Temperature Load (2) Inductance Shall Be
Life Within ±10% of Initial
Value
(3) Q Factor Shall Be
Humidity Load Life
Within ±10% of Initial
Value
Test Method & Condition
After 3 Sec. Dip in +230oC Solder Pot (Post Flux)
After 500 Hrs at 60oC and 90 ~ 95% RH
After 5 Seconds at -260oC (5 Min. 120oC Pre-Heat)
After 2 Hrs per Axis, 10 ~ 55Hz, 1.5 mm Ampl
After 100 cycles (-40o to +85oC) 30 Min. Each
After 500 Hrs at -40oC
After 500 Hrs at +85oC with rated DC Current
After 500 Hrs at 60oC with 90 ~ 95% RH
with Rated DC Current
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 27
1 page  
Molded Chip Wirewound Inductors
NIN-PC SERIES
NIC
P/N
NIN-PC1R0MTR
NIN-PC1R5MTR
NIN-PC2R2MTR
NIN-PC3R3MTR
NIN-PC4R7MTR
NIN-PC6R8KTR
NIN-PC100KTR
NIN-PC120KTR
NIN-PC150KTR
NIN-PC220KTR
NIN-PC330KTR
C SIZE (1008)
HIGH CURRENT TYPE
'L'
Inductance
(µH)
Tolerance
(std) (opt)
'Q'
Factor
(min.)
L&Q
Test
Freq.
1.0
±20%
---
10 7.96 Mhz
1.5 ±20% ---
10 7.96 Mhz
2.2
±20%
---
10 7.96 Mhz
3.3
±20%
---
8 7.96 Mhz
4.7
±20%
---
8 7.96 Mhz
6.8
±10%
---
8 7.96 Mhz
10
±10%
---
20 2.52 Mhz
12
±10%
---
20 2.52 Mhz
15
±10%
---
20 2.52 Mhz
22
±10%
---
20 2.52 Mhz
33
±10%
---
20 2.52 Mhz
NIN Series
For Quality Factor (Q) and Inductance (L)
over Frequency curves
see www.RFpassives.com
SRF
Mhz
(min.)
95
85
65
55
43
39
32
25
21
18
16
DC
Resistance
(ohms) Max.
0.45
0.55
0.65
0.85
1.2
1.3
2.2
2.7
3.2
4.0
6.5
Rated
DC Current
(mA) Max.
475
435
390
340
285
275
210
195
175
160
120
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 31
5 Page 
Molded Chip Wirewound Inductors
PACKAGING SPECIFICATIONS
t1
Perforation1.5φ±0.1
NIN Series
A
t2 P 4.0
±0.1
CARRIER TAPE DIMENSIONS (mm)
Case
Code
Type
Size W ±0.3 A ±0.2
B FC/NC/PC C 8.0 2.4
C FA/NA/PA A 8.0 2.8
D FB
B 12.0 3.6
B ±0.2
2.9
3.6
4.9
P ±0.1
4.0
4.0
8.0
E ±0.1
1.75
1.75
1.75
F ±0.1
3.5
3.5
5.5
t1
0.25
0.25
0.3
t2
1.85
2.4
3.5
2.0 ± 0.5
DIMENSIONS (mm)
Case
Code
Type
Size
B FC/NC/PC
C
C FA/NA/PA
A
D FB
B
D∅ ±2
180
180
180
W ±1.5 Qty/Reel
9.0 2000 pcs
9.0 2000 pcs
13.0 500 pcs
2.0
± 0.5
± 0.281
W
RECOMMENDED LAND PATTERNS FOR FLOW AND REFLOW SOLDERING
NIN Chip
Land Pattern
DIMENSIONS (mm)
C
Type
Size A
BC
B FC/NC/PC
C 1.4~1.5 3.5~4.0 1.2~1.6
C FA/NA/PA
A 1.6~2.0 4.0~4.6 1.9~2.4
D FB
B 2.4~2.6 5.5~6.0 2.0~3.0
A
B
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 37
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet NIN.PDF ] | |
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