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Número de pieza | 74LVC2G34 | |
Descripción | DUAL BUFFER | |
Fabricantes | Diodes | |
Logotipo | ||
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DUAL BUFFER
Description
Pin Assignments
The 74LVC2G34 is a dual buffer gate with standard push -
pull outputs. The device is designed for operation with a
power supply range of 1.65V to 5.5V. The inputs are tolerant
to 5.5V allowing this device to be used in a mixed voltage
environment. The device is fully specified for partial power
down applications using IOFF. The IOFF circuitry disables the
output preventing damaging current backflow when the
device is powered down.
The gate performs the positive Boolean function:
Y=A
Features
• Wide Supply Voltage Range from 1.65V to 5.5V
• ±24mA Output Drive at 3.0V
• CMOS low power consumption
• IOFF Supports Partial-Power-Down Mode Operation
• Inputs accept up to 5.5V
• ESD Protection Tested per JESD 22
o Exceeds 200-V Machine Model (A115-A)
o Exceeds 2000-V Human Body Model (A114-A)
o Exceeds 1000-V Charged Device Model (C101)
• Latch-Up Exceeds 100mA per JESD 78, Class II
• Range of Package Options
• SOT26, SOT363, DFN1410, and DFN1010 Available in
“Green” Molding Compound (no Br, Sb)
• Lead Free Finish/ RoHS Compliant (Note 1)
Applications
• Voltage Level Shifting
• General Purpose Logic
• Power Down Signal Isolation
• Wide array of products such as:
o PCs, networking, notebooks, netbooks, PDAs
o Computer peripherals, hard drives, CD/DVD ROM
o TV, DVD, DVR, set top box
o Cell Phones, Personal Navigation / GPS
o MP3 players ,Cameras, Video Recorders
Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at
http://www.diodes.com/products/lead_free.html.
74LVC2G34
Document number: DS35165 Rev. 4 - 2
1 of 11
www.diodes.com
July 2011
© Diodes Incorporated
1 page 74LVC2G34
DUAL BUFFER
Package Characteristics (All typical values are at VCC = 3.3V, TA = 25°C)
Symbol
Parameter
CI Input Capacitance
θJA
Thermal Resistance
Junction-to-Ambient
Test Conditions
VI = VCC – or GND
SOT26
SOT363
DFN1410
VCC
3.3
(Note 4)
Min Typ. Max Unit
3.5 pF
204
371
430 oC/W
DFN1010
510
θJC
Thermal Resistance
Junction-to-Case
SOT26
SOT363
DFN1410
DFN1010
(Note 4)
52
143
190
oC/W
250
Notes: 4. Test condition for SOT26, SOT363, DFN1410 and DFN1010 : Device mounted on FR-4 substrate PC board, 2oz copper, with minimum
recommended pad layout.
74LVC2G34
Document number: DS35165 Rev. 4 - 2
5 of 11
www.diodes.com
July 2011
© Diodes Incorporated
5 Page 74LVC2G34
DUAL BUFFER
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS
DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other
changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability
arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any
license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described
herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies
whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized
sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall
indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names
and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without
the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided
in the labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected
to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or
systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements
concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems,
notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further,
Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes
Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
74LVC2G34
Document number: DS35165 Rev. 4 - 2
11 of 11
www.diodes.com
July 2011
© Diodes Incorporated
11 Page |
Páginas | Total 11 Páginas | |
PDF Descargar | [ Datasheet 74LVC2G34.PDF ] |
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