파트넘버.co.kr MF-MSMD 데이터시트 PDF


MF-MSMD 반도체 회로 부품 판매점

PTC Resettable Fuses



Bourns Electronic Solutions 로고
Bourns Electronic Solutions
MF-MSMD 데이터시트, 핀배열, 회로
www.DataSheet4U.com
Electrical Characteristics
Model
MF-MSMD010
MF-MSMD014
MF-MSMD020
MF-MSMD030
MF-MSMD050
MF-MSMD075
MF-MSMD110
MF-MSMD125
MF-MSMD150
MF-MSMD160
MF-MSMD200
MF-MSMD260
V max.
Volts
60.0
60.0
30.0
30.0
15.0
13.2
6.0
6.0
6.0
8.0
6.0
6.0
Features
4.5 mm SMD
Fast tripping resettable circuit protection
Surface mount packaging for automated
assembly
Reduced component size and resistance
Agency recognition:
The MF-MSMD Series is currently
available, although not recommended
for new designs. The MF-MSMF
Series is preferred.
MF-MSMD Series - PTC Resettable Fuses
I max.
Amps
40
40
80
10
100
100
100
100
100
100
100
100
Ihold
Itrip
Amperes
at 23 °C
Hold
Trip
0.10
0.30
0.14
0.34
0.20
0.40
0.30
0.60
0.50
1.00
0.75
1.50
1.10
2.20
1.25
2.50
1.50
3.00
1.60
2.80
2.00
4.00
2.60
5.20
Resistance
Ohms
at 23 °C
RMin.
R1Max.
0.70
15.00
0.40
6.50
0.40
6.00
0.30
3.00
0.15
1.00
0.11
0.45
0.04
0.21
0.035
0.14
0.03
0.120
0.035
0.099
0.020
0.100
0.015
0.080
Max. Time
To Trip
Amperes Seconds
at 23 °C at 23 °C
0.5 1.5
1.5 0.15
6.0 0.06
8.0 0.10
8.0 0.15
8.0 0.20
8.0 0.30
8.0 0.4
8.0 0.5
8.0 2.0
8.0 3.0
8.0 5.0
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
1.0
1.0
1.0
1.2
1.2
1.2
1.2
1.5
1.5
1.5
1.5
1.5
Environmental Characteristics
Operating/Storage Temperature ........................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change
Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours....................±5 % typical resistance change
Thermal Shock ....................................................+85 °C to -40 °C, 20 times ..........................±10 % typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Test Procedures And Requirements For Model MF-MSMD Series
Test Test Conditions
Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 °C ............................................................Rmin R R1max
Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T max. time to trip (seconds)
Hold Current....................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning
Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................MIL-STD-202F, Method 208F..........................................95 % min. coverage
UL File Number ..................................E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number ................................CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000
TÜV Certificate Number......................R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.


MF-MSMD 데이터시트, 핀배열, 회로
Additional Features
Patents pending
www.DataSheet4U.com
Applications
High Density Circuit Board Applications:
Hard disk drives
PC motherboards
PC peripherals
Point-of-sale (POS) equipment
PCMCIA cards
MF-MSMD Series - PTC Resettable Fuses
Product Dimensions
Model
MF-MSMD010
MF-MSMD014
MF-MSMD020
MF-MSMD030
MF-MSMD050
MF-MSMD075
MF-MSMD110
MF-MSMD125
MF-MSMD150
MF-MSMD160
MF-MSMD200
MF-MSMD260
A
Min.
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
Max.
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
Packaging: 2000 pcs. per reel.
Min.
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
B
Max.
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
C
Min.
0.56
(0.022)
0.56
(0.022)
0.56
(0.022)
0.56
(0.022)
0.38
(0.015)
0.38
(0.015)
0.38
(0.015)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.25
(0.010)
Max.
0.81
(0.032)
0.81
(0.032)
0.81
(0.032)
0.81
(0.032)
0.62
(0.024)
0.62
(0.024)
0.62
(0.024)
0.48
(0.019)
0.48
(0.019)
0.48
(0.019)
0.48
(0.019)
0.48
(0.019)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
UNIT = MM
(INCHES)
Top and Bottom View
A
Side View
C
B
D
Recommended Pad Layout
1.5 ± 0.05
(.059 ± .002)
2.70 ± 0.1
(.106 ± .004)
1.5 ± 0.05
(.059 ± .002)
3.2 ± 0.1
(0.126 ± .004)
Terminal material: solder-plated copper
Termination pad solderability: Meets EIA
Specification RS-186-9E, ANSI/J-STD-002
Category 3.
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
250
200
150
100
50
0
160–220
10–20
120
Time (seconds)
Note:
• MF-MSMD models can be wave soldered and reworked.
• If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.




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MF-MSMD fuse

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