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PDF 74AUP2G79 Data sheet ( Hoja de datos )

Número de pieza 74AUP2G79
Descripción Low-power dual D-type flip-flop
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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74AUP2G79
Low-power dual D-type flip-flop; positive-edge trigger
Rev. 02 — 19 March 2008
Product data sheet
1. General description
The 74AUP2G79 is a high-performance, low-power, low-voltage, Si-gate CMOS device,
superior to most advanced CMOS compatible TTL families.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF. The IOFF
circuitry disables the output, preventing a damaging backflow current through the device
when it is powered down.
The 74AUP2G79 provides the dual positive-edge triggered D-type flip-flop. Information on
the data input (nD) is transferred to the nQ output on the LOW-to-HIGH transition of the
clock pulse (nCP). The nD input must be stable one set-up time prior to the LOW-to-HIGH
clock transition for predictable operation.
2. Features
I Wide supply voltage range from 0.8 V to 3.6 V
I High noise immunity
I Complies with JEDEC standards:
N JESD8-12 (0.8 V to 1.3 V)
N JESD8-11 (0.9 V to 1.65 V)
N JESD8-7 (1.2 V to 1.95 V)
N JESD8-5 (1.8 V to 2.7 V)
N JESD8-B (2.7 V to 3.6 V)
I ESD protection:
N HBM JESD22-A114E Class 3A exceeds 5000 V
N MM JESD22-A115-A exceeds 200 V
N CDM JESD22-C101-C exceeds 1000 V
I Low static power consumption; ICC = 0.9 µA (maximum)
I Latch-up performance exceeds 100 mA per JESD78 Class II
I Inputs accept voltages up to 3.6 V
I Low noise overshoot and undershoot < 10 % of VCC
I IOFF circuitry provides partial Power-down mode operation
I Multiple package options
I Specified from 40 °C to +85 °C and 40 °C to +125 °C

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74AUP2G79 pdf
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74AUP2G79
Low-power dual D-type flip-flop; positive-edge trigger
10. Static characteristics
Table 7. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min Typ
Tamb = 25 °C
VIH HIGH-level input voltage
VCC = 0.8 V
VCC = 0.9 V to 1.95 V
0.70 × VCC -
0.65 × VCC -
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
1.6 -
2.0 -
VIL LOW-level input voltage VCC = 0.8 V
VCC = 0.9 V to 1.95 V
--
--
VCC = 2.3 V to 2.7 V
--
VCC = 3.0 V to 3.6 V
--
VOH HIGH-level output voltage VI = VIH or VIL
IO = 20 µA; VCC = 0.8 V to 3.6 V
IO = 1.1 mA; VCC = 1.1 V
IO = 1.7 mA; VCC = 1.4 V
IO = 1.9 mA; VCC = 1.65 V
IO = 2.3 mA; VCC = 2.3 V
IO = 3.1 mA; VCC = 2.3 V
IO = 2.7 mA; VCC = 3.0 V
IO = 4.0 mA; VCC = 3.0 V
VCC 0.1 -
0.75 × VCC -
1.11 -
1.32 -
2.05 -
1.9 -
2.72 -
2.6 -
VOL LOW-level output voltage VI = VIH or VIL
IO = 20 µA; VCC = 0.8 V to 3.6 V
-
-
IO = 1.1 mA; VCC = 1.1 V
--
IO = 1.7 mA; VCC = 1.4 V
IO = 1.9 mA; VCC = 1.65 V
--
--
IO = 2.3 mA; VCC = 2.3 V
IO = 3.1 mA; VCC = 2.3 V
--
--
IO = 2.7 mA; VCC = 3.0 V
--
IO = 4.0 mA; VCC = 3.0 V
--
II
input leakage current
VI = GND to 3.6 V; VCC = 0 V to 3.6 V
-
-
IOFF
IOFF
power-off leakage current
additional power-off
leakage current
VI or VO = 0 V to 3.6 V; VCC = 0 V
VI or VO = 0 V to 3.6 V;
VCC = 0 V to 0.2 V
-
-
-
-
ICC
ICC
supply current
additional supply current
VI = GND or VCC; IO = 0 A;
VCC = 0.8 V to 3.6 V
per pin; VI = VCC 0.6 V; IO = 0 A;
VCC = 3.3 V
-
[1] -
-
-
CI input capacitance
VCC = 0 V to 3.6 V; VI = GND or VCC
-
0.6
CO output capacitance
VO = GND; VCC = 0 V
- 1.3
Max Unit
-V
-V
-V
-V
0.30 × VCC V
0.35 × VCC V
0.7 V
0.9 V
-V
-V
-V
-V
-V
-V
-V
-V
0.1
0.3 × VCC
0.31
0.31
0.31
0.44
0.31
0.44
±0.1
±0.2
±0.2
V
V
V
V
V
V
V
V
µA
µA
µA
0.5 µA
40 µA
- pF
- pF
74AUP2G79_2
Product data sheet
Rev. 02 — 19 March 2008
© NXP B.V. 2008. All rights reserved.
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74AUP2G79
Low-power dual D-type flip-flop; positive-edge trigger
Table 8. Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9.
Symbol Parameter Conditions
25 °C
40 °C to +85 °C
Min Typ[1] Max Min
Max
CPD power
f = 1 MHz;
dissipation VI = GND to VCC
capacitance VCC = 0.8 V
[3]
- 1.6 - -
-
VCC = 1.1 V to 1.3 V
- 1.7 - -
-
VCC = 1.4 V to 1.6 V
- 1.8 - -
-
VCC = 1.65 V to 1.95 V
- 1.9 - -
-
VCC = 2.3 V to 2.7 V
- 2.3 - -
-
VCC = 3.0 V to 3.6 V
- 2.7 - -
-
40 °C to +125 °C Unit
Min Max
--
--
--
--
--
--
pF
pF
pF
pF
pF
pF
[1] All typical values are measured at nominal VCC.
[2] tpd is the same as tPLH and tPHL.
[3] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of the outputs.
12. Waveforms
VI
nD input
GND
VI
nCP input
GND
VOH
nQ output
VOL
VM
tPHL
VM
VM
tPLH
VM
001aaf271
Fig 7.
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
The clock input (nCP) to output (nQ) propagation delays
74AUP2G79_2
Product data sheet
Rev. 02 — 19 March 2008
© NXP B.V. 2008. All rights reserved.
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