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PDF BD6758MWV Data sheet ( Hoja de datos )
| Número de pieza | BD6758MWV | |
| Descripción | 5-Channel System Lens Driver | |
| Fabricantes | ROHM Semiconductor | |
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Datasheet
Motor Drivers for Digital Still Cameras
5-Channel System Lens Driver
for Digital Still Cameras
BD6758MWV BD6758KN
General Description
The BD6758MWV and BD6758KN are motor drivers
that integrate 4 Full-ON type H-Bridges and 1 Linear
Constant-Current type H-Bridge. These devices are
intended to drive a stepping motor for auto focus
system, and to drive DC motors for zoom and iris.
Features
Low ON-Resistance Power CMOS Output
Drive Mode Switch Function
High-Precision(±3%) Linear Constant-Current Driver
Phase Compensation Capacitor-Free Design
for Linear Constant-Current Drive Block
High-Precision (1.2V±3%) Reference Voltage
Under Voltage Locked Out Protection
& Thermal Shut Down Circuit
Key Specifications
Power Supply Voltage Range:
2.5V to 5.5V
Motor Power Supply Voltage Range: 2.5V to 5.5V
Circuit Current(No Signal & No Load): 1.4mA(Typ)
Stand-By Current:
10μA(Max)
Control Input Voltage Range:
0V to VCCV
H-Bridge Output Current:
-0.5A/ch to +0.5A/ch
Output ON-Resistance(Channel 1 to 4): 1.2Ω(Typ)
Output ON-Resistance(Channel 5):
1.0Ω(Typ)
Operating Temperature Range: -25°C to +85°C
Package
W(Typ) x D(Typ) x H(Max)
Applications
Mobile system
Home appliance
Amusement system, etc
UQFN036V5050
5.00mm x 5.00mm x 1.00mm
VQFN36
6.20mm x 6.20mm x 0.95mm
○Product structure：Silicon monolithic integrated circuit
.www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product has no designed protection against radioactive rays
1/16
TSZ02201-0H3H0B601360-1-2
09.Dec.2015 Rev.001
1 page  
BD6758MWV BD6758KN
Description of Blocks – continued
4. Drive System of Linear Constant-Current H-bridge (Channel 5)
(a) Reference Output Voltage (with a tolerance of ±3%)
The VREF pin can output 1.2V based on the internal reference voltage. The output current of the
Constant-Current Drive block can be controlled by connecting external resistor to the VREF pin and setting the
voltage which is divided by the resistor to the output current setting pin (VLIM pin). It is recommended to place
the external 2kΩ or above resistor in consideration of the load current capacity of the VREF pin, and to place the
20kΩ or below resistor in order to minimize the fluctuation caused by the base current of the internal transistor.
(b) Output Current Detection and Current Settings
A low-value (0.1Ω to 5.0Ω) resistor can be placed between the RNF pin and ground to detect the motor winding
current. When making the RNF and SENSE pins short-circuit, the internal circuits can output the accurate
constant current by comparing the VLIM voltage with detecting voltage. To make more accurate motor winding
current, trim the external RNF resistor, and supply VLIM pin with another precise external voltage. In case of this
condition, VREF pin should be kept open.
Output Current Value IOUT[A] = VLIM[V] / RNF[Ω]
The motor winding current will be equal to 400mA3%, if 0.2V is set to the VLIM pin and a 0.5Ω external resistor is
connected to the RNF pin. If the VLIM pin is shorted to the VCC pin (or the same voltage as the VCC is set) and the
SENSE and RNF pins are shorted to the ground, this channel can drive as a Full-ON type H-bridge like other
channels.
.www.rohm.co.jp
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/16
TSZ02201-0H3H0B601360-1-2
09.Dec.2015 Rev.001
5 Page 
BD6758MWV BD6758KN
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal(GND) and large-current ground(PGND) traces, the two ground traces should be routed
separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not
cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line
impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/16
TSZ02201-0H3H0B601360-1-2
09.Dec.2015 Rev.001
11 Page | ||
| Páginas | Total 20 Páginas | |
| PDF Descargar | [ Datasheet BD6758MWV.PDF ] | |
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