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PDF BD6381EFV Data sheet ( Hoja de datos )
| Número de pieza | BD6381EFV | |
| Descripción | (BD6380EFV / BD6381EFV) Low Voltage Stepping Motor Drivers | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de BD6381EFV (archivo pdf) en la parte inferior de esta página. Total 9 Páginas | ||
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Stepping Motor Drivers
Low Voltage
Stepping Motor Drivers
BD6380EFV, BD6381EFV
No.12009EAT01
●Description
This series can drive the bipolar stepping motor used for paper feed carriages. It is a low power consumption bipolar PWM
constant current-drive driver. It is suitable for the mobile devices of a battery drive by power save function. It contributes
also to reduction of mounting area by ultra-thin and high heat-radiation (exposed metal type) HTSSOP package.
●Feature
1) Low ON resistance DMOS output
2) PWM constant current control (self oscillation)
3) Built-in spike noise cancel function (external noise filter is unnecessary)
4) Power save function
5) Built-in logic input pull-down resistor
6) Power-on reset function
7) Thermal shutdown circuit (TSD)
8) Over current protection circuit (OCP)
9) Under voltage lock out circuit (UVLO)
10) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention)
11) Electrostatic discharge: 4kV (HBM specification)
12) Adjacent pins short protection
13) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package
●Application
Mini printer, Handy printer, Monitoring camera, WEB camera, Scanner, Toy, and Robot etc.
www.DataSheet.co.kr
●Absolute maximum ratings(Ta=25℃)
Item
Symbol
BD6380EFV
BD6381EFV
Supply voltage VCC
Supply voltage VM
Power dissipation
VCC -0.2～+7.0
VM -0.2～+15.0
1.1※1
Pd 4.0※2
-0.2～+7.0
-0.2～+15.0
1.1※1
4.0※2
Input voltage for control pin
VIN -0.2～(VCC +0.3) -0.2～(VCC +0.3)
RNF maximum voltage
Maximum output current
VRNF
IOUT
0.5
0.8※3
0.5
1.2※3
Operating temperature range
Topr -25～+75
-25～+75
Storage temperature range
Tstg -55～+150
-55～+150
Junction temperature
Tjmax
150
150
※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃.
※2 4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃.
※3 Do not exceed Pd, ASO and Tjmax=150℃.
Unit
V
V
W
W
V
V
A/ch
℃
℃
℃
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
1/8
2012.02 - Rev.A
Datasheet pdf - http://www.DataSheet4U.net/
1 page  
BD6380EFV/BD6381EFV
Technical Note
●Power dissipation
○HTSSOP-B24 Package
HTSSOP-B24 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also,
the back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing
power dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is
a possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat
dissipation efficiency.
4.0W
4.0 4
3.0
2.8W
3
2.0 1.7W 2
1.1W 1
1.0
Measurement machine：TH156（Kuwano Electric）
Measurement condition：ROHM board
Board size：70*70*1.6mm3
(With through holes on the board)
The exposed metal of the backside is connected to the board with
solder.
Board①：1-layer board(Copper foil on the back 0mm2)
Board②：2-layer board(Copper foil on the back 15*15mm2)
Board③：2-layer board(Copper foil on the back 70*70mm2)
Board④：4-layer board(Copper foil on the back 70*70mm2)
Board①：θja=113.6℃/W
Board②：θja =73.5℃/W
Board③：θja =44.6℃/W
Board④：θja =31.3℃/W
0
www.DataSheet.co.kr
100 125
Ambient Temperature : Ta[℃]
Fig.2 HTSSOP-B24 Derating curve
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
5/8
2012.02 - Rev.A
Datasheet pdf - http://www.DataSheet4U.net/
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet BD6381EFV.PDF ] | |
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