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ON Semiconductor |
MC74AC240, MC74ACT240
Octal Buffer/Line Driver
with 3-State Outputs
The MC74AC240/74ACT240 is an octal buffer and line driver
designed to be employed as a memory address driver, clock driver and
bus oriented transmitter or receiver which provides improved PC
board density.
Features
• 3−State Outputs Drive Bus Lines or Buffer Memory Address
Registers
• Outputs Source/Sink 24 mA
• ′ACT240 Has TTL Compatible Inputs
• These are Pb−Free Devices
TRUTH TABLE
Inputs
Outputs
OE1 D (Pins 12, 14, 16, 18)
LL
LH
HX
H
L
Z
NOTE:
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
TRUTH TABLE
Inputs
Outputs
OE2 D
LL
LH
HX
(Pins 3, 5, 7, 9)
H
L
Z
NOTE:
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
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SOIC−20W
DW SUFFIX
CASE 751D
1
TSSOP−20
DT SUFFIX
CASE 948E
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 7 of this data sheet.
VCC OE2
20 19 18 17 16 15 14 13 12 11
1 2 3 4 5 6 7 8 9 10
OE1 GND
Figure 1. Pinout: 20−Lead Packages Conductors
(Top View)
© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. 9
1
Publication Order Number:
MC74AC240/D
MC74AC240, MC74ACT240
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
VIN
VOUT
IIK
IOK
IOUT
ICC
IGND
TSTG
TL
TJ
qJA
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND) (Note 1)
DC Input Diode Current
DC Output Diode Current
DC Output Sink/Source Current
DC Supply Current, per Output Pin
DC Ground Current, per Output Pin
Storage Temperature Range
Lead temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance (Note 2)
SOIC
TSSOP
−0.5 to +7.0
−0.5 to VCC +0.5
−0.5 to VCC +0.5
±20
±50
±50
±50
±100
*65 to )150
260
140
65.8
110.7
V
V
V
mA
mA
mA
mA
mA
_C
_C
_C
_C/W
MSL Moisture Sensitivity
Level 1
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 30% − 35%
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
UL 94 V−0 @ 0.125 in
> 2000
> 200
> 1000
V
ILatchup Latchup Performance
Above VCC and Below GND at 85_C (Note 6)
±100
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
2. The package thermal impedance is calculated in accordance with JESD 51−7.
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min Typ Max
Unit
VCC Supply Voltage
′AC
′ACT
2.0 5.0 6.0
4.5 5.0 5.5
V
VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND)
0 − VCC V
Input Rise and Fall Time (Note 7)
tr, tf ′AC Devices except Schmitt Inputs
VCC @ 3.0 V − 150 −
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
ns/V
Input Rise and Fall Time (Note 8)
tr, tf ′ACT Devices except Schmitt Inputs
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
ns/V
TA Operating Ambient Temperature Range
−40 25
85
°C
IOH Output Current − High
−
− −24
mA
IOL Output Current − Low
− − 24 mA
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
7. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
8. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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