|
|
PDF 74HC1G125 Data sheet ( Hoja de datos )
| Número de pieza | 74HC1G125 | |
| Descripción | Bus buffer/line driver 3-state | |
| Fabricantes | Philips | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de 74HC1G125 (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
|
No Preview Available !
INTEGRATED CIRCUITS
DATA SHEET
74HC1G125; 74HCT1G125
Bus buffer/line driver; 3-state
Product specification
File under Integrated Circuits, IC06
1998 Nov 10
1 page  
Philips Semiconductors
Bus buffer/line driver; 3-state
Product specification
74HC1G125; 74HCT1G125
DC CHARACTERISTICS
Family 74HC1G
Additional type data to the recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Tamb (°C)
SYMBOL
PARAMETER
−40 to +85
−40 to +125
MIN. TYP.(1) MAX. MIN. MAX.
VIH HIGH-level input
voltage
1.5 1.2
3.15 2.4
−
−
1.5 −
3.15 −
4.2 3.2 −
4.2 −
VIL
LOW-level input voltage −
0.8 0.5 −
0.5
− 2.1 1.35 − 1.35
− 2.8 1.8 − 1.8
VOH HIGH-level output
1.9 2.0 −
1.9 −
voltage; all outputs
4.4 4.5 −
4.4 −
5.9 6.0 −
5.9 −
VOH HIGH-level output
voltage; standard
outputs
4.13 4.32 −
5.63 5.81 −
3.7 −
5.2 −
VOL LOW-level output
− 0 0.1 − 0.1
voltage; all outputs
−
0
0.1 −
0.1
− 0 0.1 − 0.1
VOL LOW-level output
voltage; standard
outputs
− 0.15 0.33 − 0.4
− 0.16 0.33 − 0.4
II input leakage current − − 1.0 − 1.0
ICC quiescent supply
current
− − 10 − 20
TEST CONDITIONS
UNIT
VCC (V)
OTHER
V 2.0
4.5
6.0
V 2.0
4.5
6.0
V 2.0
4.5
6.0
V 4.5
6.0
V 2.0
4.5
6.0
V 4.5
6.0
µA 6.0
µA 6.0
VI = VIH or VIL:
−IO = 20 µA
VI = VIH or VIL;
−IO = 2.0 mA
VI = VIH or VIL;
−IO = 2.6 mA
VI = VIH or VIL;
IO = 20 µA
VI = VIH or VIL;
IO = 2.0 mA
VI = VIH or VIL;
IO = 2.6 mA
VI = VCC or GND
VI = VCC or GND;
IO = 0
Note
1. All typical values are measured at Tamb = 25 °C.
1998 Nov 10
5
5 Page 
Philips Semiconductors
Bus buffer/line driver; 3-state
Product specification
74HC1G125; 74HCT1G125
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted IC’s, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering IC’s can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1998 Nov 10
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet 74HC1G125.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| 74HC1G125 | Bus buffer/line driver 3-state | Philips |
| 74HC1G126 | Bus buffer/line driver 3-state | Philips |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |