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RKZ-KL Series
Silicon Planar Zener Diode for Surge Absorption and Stabilizer
REJ03G1519-0100
Rev.1.00
May 09, 2007
Features
• Emboss Taping Reel Pack.
• Extremely small Flat Lead Package (EFP) is suitable for surface mount design.
Ordering Information
Part No.
RKZ-KL Series
Laser Mark
Let to Mark Code
Package Name
EFP
Package Code
PXSF0002ZA-A
Pin Arrangement
Cathode mark
Mark
1 C1 2
REJ03G1519-0100 Rev.1.00 May 09, 2007
Page 1 of 5
RKZ-KL Series
Absolute Maximum Ratings
Item
Power dissipation
Junction temperature
Storage temperature
Note: 1. With P.C. Board.
Pd *1
Tj
Tstg
Symbol
Value
100
150
–55 to +150
(Ta = 25°C)
Unit
mW
°C
°C
Electrical Characteristics
(Ta = 25°C)
Zener Voltage
Reverse Current Dynamic Resistance ESD-Capability *2
Part No.
RKZ2.0BKL
VZ (V) *1
Min Max
1.90 2.20
Test
Condition
IZ (mA)
5
IR (µA)
Max
120
Test
Condition
VR (V)
0.5
rd (Ω)
Max
100
Test
Condition
IZ (mA)
5
— (kV) *2
Min
30
RKZ2.2BKL
2.10 2.40
5
120 0.7 100
5
30
RKZ2.4BKL
2.30 2.60
5
120 1.0 100
5
30
RKZ2.7B2KL 2.65 2.90
5
120 1.0 110
5
30
RKZ3.0B2KL 2.95 3.20
5
50 1.0 120 5
30
RKZ3.3B2KL 3.25 3.50
5
20 1.0 130 5
30
RKZ3.6B2KL 3.55 3.80
5
10 1.0 130 5
30
RKZ3.9B2KL 3.87 4.10
5
10 1.0 130 5
30
RKZ4.3B2KL 4.15 4.34
5
10 1.0 130 5
30
RKZ4.7B2KL 4.55 4.75
5
10 1.0 130 5
30
RKZ5.1B2KL 4.98 5.20
5
5 1.5 130 5
30
RKZ5.6B2KL 5.49 5.73
5
5 2.5 80 5
30
RKZ6.2B2KL 6.06 6.33
5
2 3.0 50 5
30
RKZ6.8B2KL 6.65 6.93
5
2 3.5 30 5
30
RKZ7.5B2KL 7.28 7.60
5
2 4.0 30 5
30
RKZ8.2B2KL 8.02 8.36
5
2 5.0 30 5
30
RKZ9.1B2KL 8.85 9.23
5
2 6.0 30 5
30
RKZ10B2KL
9.77 10.21
5
2 7.0 30 5
30
RKZ11B2KL
10.76 11.22
5
2 8.0 30 5
30
RKZ12B2KL
11.74 12.24
5
2 9.0 35 5
30
RKZ13B2KL
12.91 13.49
5
2
10.0
35
5
30
RKZ15B2KL
14.34 14.98
5
2
11.0
40
5
25
RKZ16B2KL
15.85 16.51
5
2
12.0
40
5
25
RKZ18B2KL
17.56 18.35
2
2
13.0
45
2
25
RKZ20B2KL
19.52 20.39
2
2
15.0
50
2
20
RKZ22B2KL
21.54 22.47
2
2
17.0
55
2
20
RKZ24B2KL
23.72 24.78
2
2
19.0
60
2
15
RKZ27BKL
25.10 28.90
2
2
21.0
70
2
15
RKZ30BKL
28.00 32.00
2
2
23.0
80
2
13
RKZ33BKL
31.00 35.00
2
2
25.0
80
2
8
RKZ36BKL
34.00 38.00
2
2
27.0
90
2
8
Notes: 1. Tested with pulse (Pw = 40 ms).
2. C =150 pF, R = 330 Ω, Both forward and reverse direction 10 pulse
Failure criterion ; According to IR spec
3. For EFP package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip
part is considered as unquestioned. Please kindly consider soldering nature.
REJ03G1519-0100 Rev.1.00 May 09, 2007
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