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Número de pieza | BAS16 | |
Descripción | High Conductance Ultra Fast Diode | |
Fabricantes | Fairchild Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de BAS16 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! BAS16
Small Signal Diode
February 2015
3
2
1
SOT-23
3
A6
12
Connection Diagram
3
1 2NC
Ordering Information
Part Number
BAS16
BAS16_D87Z
Top Mark
A6
A6
Package
SOT-23 3L
SOT-23 3L
Packing Method
Tape and Reel, 7 inch Reel, 3000 pcs
Tape and Reel, 13 inch Reel, 10000 pcs
Absolute Maximum Ratings(1), (2)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Value
Unit
VRRM
IF(AV)
IFSM
Maximum Repetitive Reverse Voltage
Average Rectified Forward Current
Non-Repetitive Peak Forward
Surge Current
Pulse Width = 1.0 second
Pulse Width = 1.0 microsecond
85
200
1.0
2.0
V
mA
A
TSTG
TJ
Storage Temperature Range
Operating Junction Temperature
-55 to +150
-55 to +150
°C
°C
Notes:
1. These ratings are based on a maximum junction temperature of 150°C.
2. These are steady-state limits. Fairchild Semiconductor should be consulted on applications involving pulsed or
low-duty-cycle operations.
© 2001 Fairchild Semiconductor Corporation
BAS16 Rev. 1.3
www.fairchildsemi.com
1 page Physical Dimensions
2.92±0.20
3
0.95
1.40
1.30+-00..1250
2.20
(0.29)
1
0.95
1.90
1.20 MAX
(0.93)
C
GAGE PLANE
0.23
0.08
0.20 MIN
(0.55)
2
0.60
0.37
0.20
AB
1.90
LAND PATTERN
RECOMMENDATION
1.00
SEE DETAIL A
0.10
0.00
0.10
C
2.40±0.30
NOTES: UNLESS OTHERWISE SPECIFIED
0.25
SEATING
PLANE
A) REFERENCE JEDEC REGISTRATION
TO-236, VARIATION AB, ISSUE H.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE INCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M - 1994.
E) DRAWING FILE NAME: MA03DREV10
SCALE: 2X
Figure 10. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE
© 2001 Fairchild Semiconductor Corporation
BAS16 Rev. 1.3
5
www.fairchildsemi.com
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet BAS16.PDF ] |
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