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NXP Semiconductors |
DISCRETE SEMICONDUCTORS
DATA SHEET
k, halfpage
M3D088
BAP50-04
General purpose PIN diode
Preliminary specification
1999 May 10
Philips Semiconductors
General purpose PIN diode
Preliminary specification
BAP50-04
FEATURES
• Two elements in series configuration in a small-sized
plastic SMD package
• Low diode capacitance
• Low diode forward resistance.
PINNING
PIN
1
2
3
DESCRIPTION
anode
cathode
common connection
APPLICATIONS
• General RF applications.
handbook, halfpa2ge
1
DESCRIPTION
Two planar PIN diodes in series configuration in a SOT23
small plastic SMD package.
21
3
3 MAM232
Marking code: 4Lp.
Fig.1 Simplified outline (SOT23) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
Per diode
VR continuous reverse voltage
IF continuous forward current
Ptot total power dissipation
Tstg storage temperature
Tj junction temperature
Ts = 90 °C
MIN. MAX. UNIT
− 50 V
− 50 mA
− 250 mW
−65 +150 °C
−65 +150 °C
1999 May 10
2
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