RClamp7534P 반도체 회로 부품 판매점
4-Line ESD Protection
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 Semtech |
PROTECTION PRODUCTS - µClamp®
Description
RClamp®7534P is a high performance TVS array
aimed at simultaneously protecting 4 signal lines from
overvoltage events caused by ESD, CDE (Cable Dis-
charge Events) and EFT (electrical fast transients).
RClamp7534P features an extremely low max capaci-
tance of 0.19pF (Typical) and is designed to protect high
speed interfaces such as HDMI 2.0, 10-gigabit Ethernet,
and USB 3.0.
RCamp7534P is a bi-directional device designed to
provide extremely low clamping voltage for both positive
and negative ESD pulses. With a typical dynamic resis-
tance of 1.0 Ohm, the RClamp7534P turns on quickly
during overvoltage events to protect sensitive systems.
RClamp7534P is in a 5-pin SGP2010N5 package mea-
suring 2.0 x 1.0mm with a nominal height of 0.50mm.
The leads have a nominal pin-to-pin pitch of 0.40mm.
Flow- through package design simplifies PCB layout and
maintains signal integrity on high-speed lines.
The combination of low peak ESD clamping, low dynamic
resistance, and innovative package design enables this
device to provide the highest level of ESD protection.
RClamp7534P
Ultra Low Capacitance RClamp®
4-Line ESD Protection
Features
u ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±25kV (air), ±20kV (contact)
IEC 61000-4-5 (Lightning) 4A (8/20µs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
u Package design optimized for high speed lines
u Protects four high-speed lines
u Low capacitance: 0.19pF Typical (I/O to Ground)
u Low ESD clamping voltage
u Low dynamic resistance: 1.0 Ohm (Typ)
u Low leakage current
u Solid-state silicon-avalanche technology
Mechanical Characteristics
u SGP2010N5 5-pin package (2.0 x 1.0 x 0.50mm)
u Pb-Free, Halogen Free, RoHS/WEEE Compliant
u Lead Finish: NiPdAu
u Marking: Marking code
u Packaging: Tape and Reel
Applications
u HDMI 2.0
u USB 3.1
u Display Port 1.2
u Thunderbolt
u 10GbE
u V-By-One
u MHL
Package Dimensions
2.00
12
1.00
0.40 BSC
0.50
Nominal Dimensions in mm
11/19/2014
Circuit Diagram
Pin 3
GND
SGP2010N5 (Bottom View)
1 www.semtech.com
RClamp7534P
PROTECTION PRODUCTS
Absolute Maximum Ratings
Rating
Peak Pulse Current (tp = 8/20µs)
ESD per IEC 61000-4-2 (Air)(1)
ESD per IEC 61000-4-2 (Contact)(1)
Operating Temperature
Storage Temperature
Symbol
IPP
VESD
TJ
TSTG
Value
4
±25
±20
-40 to +85
-55 to +150
Units
A
kV
OC
OC
Electrical Characteristics (T=25OC unless otherwise specified)
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Reverse Stand-Off Voltage
Reverse breakdown Voltage
Reverse Leakage Current
Clamping Voltage
ESD Clamping Voltage2
ESD Clamping Voltage2
Dynamic Resistance2, 3
Junction Capacitance
VRWM
VBR
IR
VC
VC
VC
RDYN
CJ
Any I/O to Ground
IBR = 1mA
Any I/O to Ground
VRWM = 5V
Any I/O to Ground
IPP = 1A, tp = 8/20µs
IPP = 4A, tp = 8/20µs
IPP = 4A
tp = 0.2/100ns
IPP = 16A
tp = 0.2/100ns
tp = 100ns
I/O pin to GND
f = 1MHz
VR = 0V
5
6.5 9.7 11.5
V
V
5 100
15
25
14
nA
V
V
V
24 V
1.0 Ohms
0.19 0.22
pF
Notes
1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
2014 Semtech Corporation.
2
www.semtech.com
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