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Semtech |
RClamp0564P
Femto Farad RailClamp®
4-Line, 170fF ESD Protection
PROTECTION PRODUCTS
Description
RClamp®0564P is an ultra low capacitance ESD
protection device specifically designed to protect high-
speed differential lines. It offers desirable characteristics
for board level protection including fast response time,
low operating and clamping voltage, and no device
degradation
RClamp0564P features extremely good ESD protection
characteristics highlighted by low peak ESD clamping
voltage, and high ESD withstand voltage (+/-10kV
contact per IEC 61000-4-2). RClamp0564P is designed
to minimize both the ESD peak clamping and the TLP
clamping. Package inductance is reduced at each
pin resulting in lower peak ESD clamping voltage.
RClamp0564P has a typical capacitance of 0.17pF
allowing it to be used in high bandwidth applications
such as HDMI 2.0 4K/2K, Thunderbolt, and USB 3.1. Each
device will protect four high-speed data lines operating
up to 5 volts.
RClamp0564P is in a 5-pin SGP2010N5 package
measuring 2.0 x 1.0mm with a nominal height of
0.60mm. The leads have a nominal pin-to-pin pitch of
0.40mm. Flow- through package design simplifies PCB
layout and maintains signal integrity on high-speed lines.
Features
• High ESD Withstand Voltage
IEC 61000-4-2 (ESD) 10kV (contact)
• Ultra-Low Capacitance: 0.17pF Typical
• Very Small PCB Area
• Protects Four High-Speed Data Lines
• Working Voltage: 5V
• Low Dynamic Resistance: 0.65 Ohms
• Large Operating Bandwidth: 12GHz
• Solid-State Silicon-Avalanche Technology
Mechanical Characteristics
• SGP2010N5 Package
• Pb-Free, Halogen Free, RoHS/WEEE Compliant
• Nominal Dimensions: 2.0 x 1.0 x 0.60 mm
• Lead Pitch: 0.40mm
• Lead Finish: NiPdAu
• Marking : Marking Code
• Packaging : Tape and Reel
Applications
• HDMI 1.4, HDMI1.4b and HDMI 2.0
• USB 3.0 and USB 3.1
• USB Type-C
• Thunderbolt
• MIPI / MDDI
Nominal Dimensions
Schematic
2.00
12
1.00
0.40 BSC
0.60
Nominal Dimensions in mm
RClamp0564P
Final Datasheet
July 22, 2015
Rev 3.0
www.semtech.com
Pin 3
GND
1
Semtech
Absolute Maximum Ratings
Rating
Peak Pulse Current (tp = 8/20µs)
ESD per IEC 61000-4-2 (Contact)(1)
ESD per IEC 61000-4-2 (Air)(2)
Operating Temperature
Storage Temperature
Symbol
IPP
VESD
TJ
TSTG
Value
3
±10
±15
-40 to +85
-55 to +150
Units
A
kV
OC
OC
Electrical Characteristics (T=25OC unless otherwise specified)
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Holding Current
Reverse Leakage Current
Clamping Voltage3
ESD Clamping Voltage4
ESD Clamping Voltage4
Dynamic Resistance4, 5
Junction Capacitance
Cutoff Frequency
Symbol Conditions
VRWM
VBR
IH
IR
-40OC to 85OC
It = 10mA
VRWM = 5V
-40OC to 85OC
T = 25OC
T = 85OC
VC IPP = 3A, tp = 8/20µs
VC IPP = 4A, tp = 0.2/100ns (TLP)
VC IPP = 16A, tp = 0.2/100ns (TLP)
RDYN tp = 0.2/100ns (TLP)
CJ VR = 0V, f = 1MHz T = 25OC
FC -3dB
Min. Typ.
6.5 9.5
100
1
10
4
5.5
13.5
0.65
0.17
12
Max.
5
10.5
50
150
0.20
Units
V
V
mA
nA
nA
V
V
V
Ohms
pF
GHz
Notes:
(1) Measured with a 40dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to Ground Refer-
ence Plane (GRP)
(2) In-System ESD withstand voltage
(3) Measured using a 1.2/50us voltage, 8/20us current combination waveform. Clamping is defined as the peak voltage across the device
after the device snaps back to a conducting state.
(4)
(5)
Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr
Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
=
0.2ns,
ITLP
and
VTLP
averaging
window:
t1
=
70ns
to
t2
=
90ns.
RClamp0564P
Final Datasheet
July 22, 2015
Rev 3.0
www.semtech.com
2
Semtech
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