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Toshiba Semiconductor |
2SK2200
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (L2−π−MOSV)
2SK2200
Chopper Regulator, DC−DC Converter and Motor Drive
Applications
Unit: mm
z 4-V gate drive
z Low drain−source ON resistance : RDS (ON) = 0.28 Ω (typ.)
z High forward transfer admittance : |Yfs| = 3.5 S (typ.)
z Low leakage current
: IDSS = 100 μA (max) (VDS = 100 V)
z Enhancement mode
: Vth = 0.8~2.0 V (VDS = 10 V, ID = 1 mA)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Drain−source voltage
Drain−gate voltage (RGS = 20 kΩ)
Gate−source voltage
Drain current
DC (Note 1)
Pulse (Note 1)
Drain power dissipation (Tc = 25°C)
Single pulse avalanche energy
(Note 2)
Avalanche current
Repetitive avalanche energy (Note 3)
Channel temperature
Storage temperature range
VDSS
VDGR
VGSS
ID
IDP
PD
EAS
IAR
EAR
Tch
Tstg
100
100
±20
3
12
1.3
140
3
0.13
150
−55~150
V
V
V
A
A
W
mJ
A
mJ
°C
°C
JEDEC
―
JEITA
―
TOSHIBA
2-8M1B
Weight: 0.54 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristics
Symbol
Max Unit
Thermal resistance, channel to
ambient
Rth (ch−a)
96.1 °C / W
Note 1: Ensure that the channel temperature does not exceed 150°C.
Note 2: VDD = 50 V, Tch = 25°C (initial), L = 25 mH, RG = 25 Ω, IAR = 3 A
Note 3: Repetitive rating: pulse width limited by maximum channel temperature
This transistor is an electrostatic-sensitive device.
Please handle with caution.
1 2006-11-20
Electrical Characteristics (Ta = 25°C)
Characteristics
Gate leakage current
Drain cut−off current
Drain−source breakdown
voltage
Gate threshold voltage
Drain−source ON resistance
Forward transfer admittance
Input capacitance
Reverse transfer capacitance
Output capacitance
Rise time
Symbol
Test Condition
IGSS
IDSS
VGS = ±16 V, VDS = 0 V
VDS = 100 V, VGS = 0 V
V (BR) DSS ID = 10 mA, VGS = 0 V
Vth
RDS (ON)
|Yfs|
Ciss
Crss
Coss
VDS = 10 V, ID = 1 mA
VGS = 4 V, ID = 2 A
VGS = 10 V, ID = 2 A
VDS = 10 V, ID = 2 A
VDS = 10 V, VGS = 0 V, f = 1 MHz
tr
2SK2200
Min Typ. Max Unit
— — ±10 μA
— — 100 μA
100 —
—
V
0.8 — 2.0
V
— 0.36 0.45
mΩ
— 0.28 0.35
1.5 3.5
—
S
— 280 —
— 50 — pF
— 105 —
— 20 —
Switching time
Turn−on time
Fall time
ton
tf
— 50 —
ns
— 40 —
Turn−off time
Total gate charge (Gate−source
plus gate−drain)
Gate−source charge
Gate−drain (“miller”) charge
toff
Qg
Qgs VDD ≈ 80 V, VGS = 10 V, ID = 3 A
Qgd
— 170 —
— 13.5 —
— 8.5 —
—5—
nC
Source−Drain Ratings and Characteristics (Ta = 25°C)
Characteristics
Continuous drain reverse current
(Note 1)
Pulse drain reverse current
(Note 1)
Forward voltage (diode)
Reverse recovery time
Reverse recovered charge
Symbol
Test Condition
IDR —
IDRP
VDSF
trr
Qrr
—
IDR = 3 A, VGS = 0 V
IDR = 3 A, VGS = 0 V, dIDR / dt = 50 A / μs
Min Typ. Max Unit
—— 3 A
— — 12 A
— — −1.5 V
— 100 —
ns
— 0.2 — μC
Marking
K2200
Part No. (or abbreviation code)
Lot No.
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
2
2006-11-20
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