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PDF RFCM4363 Data sheet ( Hoja de datos )
| Número de pieza | RFCM4363 | |
| Descripción | PUSH PULL MODULE | |
| Fabricantes | RF Micro Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de RFCM4363 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
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RFCM4363
45-1218MHZ GAAS/GAN
PUSH PULL MODULE
The RFCM4363 is a Push Pull amplifier SMD module. The part
employs GaAs MESFET, GaAs pHemt and GaN Hemt die and is
operated from 45MHz to 1218MHz. It provides excellent linearity
and superior return loss performance with low noise and optimal
reliability.
DC current of the device can be externally adjusted for optimum
distortion performance versus power consumption over a wide
range of output level.
Current Setting V+
INPUT
RFCM4363
OUTPUT
Package: 9 pin,
11.0 mm x 8.5 mm x 1.375mm
Features
Excellent Linearity
Superior Return Loss Performance
Extremely Low Distortion
Optimal Reliability
Low Noise
Unconditionally Stable Under all
Terminations
27.5 dB Min. Gain at 1218MHz
270mA Max. at 24VDC
Applications
45MHz to 1218MHz CATV
Amplifier Systems
Functional Block Diagram
Ordering Information
RFCM4363SB
RFCM4363SQ
RFCM4363SR
RFCM4363TR7
RFCM4363TR13
RFCM4363PCBA-410
RFCM4363PCK-410
Sample bag with 5 pieces
Sample bag with 25 pieces
7” Reel with 100 pieces
7” Reel with 500 pieces
13” Reel with 1000 pieces
Fully Assembled Evaluation Board
Fully Assembled Evaluation Board with
Sample Bag
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected].
DS141001
RF MICRO DEVICES® and RFMD® are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names,
trademarks, and registered trademarks are the property of their respective owners. ©2013, RF Micro Devices, Inc.
CM4363-E020
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1 page  
RFCM4363
Evaluation Board Assembly Drawing
Note:
The ground plane of the RFCM4363 module should be soldered onto a board equipped with as many thermal vias as possible.
Underneath this thermal via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete module DC
power (up to 6.5 Watts). In any case the module backside temperature should not exceed 100°C.
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
DS141001
For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected].
The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of
third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended
application circuitry and specifications at any time without prior notice.
CM4363-E020
5 of 8
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet RFCM4363.PDF ] | |
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