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PDF RF7225 Data sheet ( Hoja de datos )
| Número de pieza | RF7225 | |
| Descripción | 3V W-CDMA BAND 5 LINEAR PA MODULE | |
| Fabricantes | RF Micro Devices | |
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Hay una vista previa y un enlace de descarga de RF7225 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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RF7225
3V W-CDMA BAND 5 LINEAR PA MODULE
Package Style: Module, 10-Pin, 3mmx3mmx1.0mm
Features
HSDPA and HSPA+ Compliant
Low Voltage Positive Bias
Supply (3.0V to 4.35V)
+28.0dBm Linear Output
Power (+26.5dBm HSDPA)
High Efficiency Operation
41% at POUT=+28.0dBm
22% at POUT=+18.0dBm
11% at POUT=+10.0dBm
Low Quiescent Current in Low
Power Mode: 6mA
Internal Voltage Regulator
Eliminates the Need for Exter-
nal Reference Voltage (VREF)
3-Mode Power States with
Digital Control Interface
Integrated Power Coupler
Integrated Blocking and Col-
lector Decoupling Capacitors
Applications
WCDMA/HSDPA/HSUPA Wire-
less Handsets and Data
Cards
Dual-Mode UMTS Wireless
Handsets
VBAT 1
RF IN 2
VMODE1 3
VMODE0 4
VEN 5
AMP
Bias Control
& PA/VMODE
Enable
10 VCC
9 RF OUT
8 CPL IN
7 GND
6 CPL OUT
Functional Block Diagram
Product Description
The RF7225 is a high-power, high-efficiency, linear power amplifier
designed for use as the final RF amplifier in 3V, 50 W-CDMA mobile cel-
lular equipment and spread-spectrum systems. This PA is developed for
UMTS Band 5 which operates in the 824MHz to 849MHz frequency band.
The RF7225 has two digital control pins to select one of three power
modes to optimize performance and current drain at lower power levels.
The part also has an integrated directional coupler which eliminates the
need for an external discrete coupler at the output. The RF7225 is fully
HSDPA and HSPA+ compliant and is assembled in a 10-pin, 3mmx3mm
module.
Ordering Information
RF7225
3V W-CDMA Band 5 Linear PA Module
RF7225PCBA-410 Fully Assembled Evaluation Board
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Prelim DS110224
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
1 of 6
1 page  
Preliminary Application Schematic
RF7225
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch
to 8inch gold over 180inch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land Pattern
PCB Metal Land Pattern (Top View)
Prelim DS110224
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
5 of 6
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet RF7225.PDF ] | |
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