|
ON Semiconductor |
7SB3126
Bus Switch
The 7SB3126 Bus Switch is an advanced high−speed line switch in
ultra−small footprint.
Features
• High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V
• 3 W Switch Connection Between 2 Ports
• Power Down Protection Provided on Inputs
• Ultra−Small Packages
• These are Pb−Free Devices
AB
OE
Figure 1. Logic Diagram
OE 1
5 VCC
A2
GND 3
4B
Figure 2. TSOP−5/SC−88A
(Top View)
OE 1
A2
GND 3
6 VCC
5 NC
4B
Figure 3. ULLGA6/UDFN6
(Top View)
Function Table
Input OE
L
H
Function
Disconnect
B=A
http://onsemi.com
MARKING
DIAGRAMS
5
1
SOT−353/SC70−5/SC−88A
DF SUFFIX
CASE 419A
5
AJ MG
G
1
5
1
SOT23−5/TSOP−5/SC59−5
DT SUFFIX
CASE 483
5
AF MG
G
1
1
ULLGA6
1.0 x 1.0
CASE 613AD
M
G
1
ULLGA6
1.2 x 1.0
CASE 613AE
M
G
ULLGA6
1.45 x 1.0
CASE 613AF
M
G
1
UDFN6
1.2 x 1.0
CASE 517AA
M
G
1
AJ, AF, J, 6, A, K = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2010
September, 2010 − Rev. 1
1
Publication Order Number:
7SB3126/D
7SB3126
Table 1. MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
VIN
VI/O
IIK
IOK
IO
ICC
IGND
TSTG
TL
TJ
qJA
DC Supply Voltage
Control Pin Input Voltage
Switch Input / Output Voltage
Control Pin DC Input Diode Current
Switch I/O Port DC Diode Current
On−State Switch Current
Continuous Current Through VCC or GND
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
VIN < GND
VI/O < GND
SC70−5/SC−88A (Note 1)
TSOP−5
ULLGA6/UDFN6
−0.5 to +7.0
−0.5 to +7.0
−0.5 to +7.0
−50
−50
±128
±150
±150
±150
−65 to +150
260
150
350
230
496
V
V
V
mA
mA
mA
mA
mA
mA
°C
°C
°C
°C/W
PD Power Dissipation in Still Air at 85°C
SC70−5/SC−88A (Note 1)
TSOP−5
ULLGA6/UDFN6
150
200
252
mW
MSL
Moisture Sensitivity
Level 1
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34
Human Body Mode (Note 2)
Machine Mode (Note 3)
Charged Device Mode (Note 4)
UL 94 V−0 @ 0.125 in
>2000
>200
N/A
V
ILATCHUP
Latchup Performance Above VCC and Below GND at 85°C (Note 5)
±100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/ JESD22−A114−A
3. Tested to EIA/ JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA / JESD78.
Table 2. RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
VI
VI/O
TA
Dt / DV
Positive DC Supply Voltage
Control Pin Input Voltage
Switch Input / Output Voltage
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
Control Input
Switch I/O
Min
4.0
0
0
−55
0
0
Max
5.5
5.5
5.5
+125
5
DC
Unit
V
V
V
°C
nS/V
http://onsemi.com
2
|